+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Samsung Electronics achieves LCA verification

News

Environmental impact of chips manufactured at Samsung's global sites to be shared to accelerate its B2B customers’ carbon neutrality goals.

Samsung Electronics has established a Life Cycle Assessment (LCA) on the product carbon footprint of its semiconductor business and achieved verification from DNV, one of the world’s leading independent certification bodies.

LCA is a methodology for assessing environmental impacts throughout the lifecycle of commercial products, processes, or services, by quantifying the amount of energy, materials and waste discharge. In detail, on its semiconductors’ carbon footprint, Samsung’s LCA covers raw material extraction to chip manufacturing, assembling and testing. Its results are in accordance with ISO 14040, ISO 14044 and ISO 14067 to ensure credibility and transparency.

The carbon footprint is commonly used by Samsung and its customers to recognize the environmental impact across all phases of Samsung’s semiconductor products and can be used as a metric to track and reduce carbon emissions.

“Since 2019, we have been actively mobilizing efforts to measure and reduce the carbon emissions of our key memory and logic solutions,” said Dooguen Song, Executive Vice President of the Environment, Health and Safety (EHS) Center at Samsung Electronics. “By leveraging LCA, we will be able to support our customers to achieve their carbon neutrality, as well as becoming more transparent on the environmental impact of the semiconductors we produce worldwide.”

“As a global expert in energy and environmental certification, DNV is pleased to have partnered with and to congratulate Samsung on successfully establishing its reliable LCA,” said JangSup Lee, CEO of DNV Business Assurance Korea. “Together with global business leaders like Samsung, we will continue to take part in creating a more sustainable environment in the future.”

Since 2019, 37 of Samsung’s semiconductor products received carbon footprint accreditation from the Carbon Trust and UL, 6 of its memory products certified for carbon reduction from Carbon Trust. Samsung’s eco-conscious product portfolio includes DRAM, SSD, embedded storage, mobile SoC, mobile Image Sensor, automotive LED packages.

Leveraging its LCA established at the end of last year, Samsung will quantify the carbon footprints of chips manufactured across all of its global manufacturing, testing and assembly locations in Korea, China and the U.S.

With sustainability at its core, Samsung will expand its LCA to include water and resource footprints to provide a more comprehensive assessment that will ultimately reduce the environmental impact of various applications such as mobile and wearables, data centers, consumer electronics, automotive, communications and more.

Tektronix and EA Elektro-Automatik offer expanded power portfolio
83% of supply chains can’t respond to disruptions in 24 hours
CMC Microsystems and ventureLAB sign MoU
Renesas introduces FemtoClock 3 timing solution
Mycronic receives order for SLX mask writer
Rapidus reveals US subsidiary and opens Silicon Valley office
Infineon introduces news MOTIX motor gate driver IC
Brewer Science unveils Smart Warehouse Monitor System
Symposium to showcase breakthroughs in microelectronics
CHIPS for America promotes over $50 million funding opportunity
SEMI University launches in-person courses
Samsung Electronics to establish Texan semiconductor ecosystem
Semiconductor chips drive innovation in AI and industries
Semiconductor equipment sales slip to $106.3 billion
Mouser Electronics receives 2023 Global Best Service Distributor of the Year Award from Diodes Incorporated
Quantum processor testing and measurement facilities up and running
Semiconductor Research Corporation announces 2024 call for research
Trend report unveils the future of circular electronics
PCIM Europe 2024: highlights and new records
PI contributes to technology node development
QP Technologies achieves ANSI/ESD S20.20 Certification
Renesas commences operations of Kofu Factory
TRI wins three Innovation Awards
Tektronix and recently acquired EA Elektro-Automatik offer expanded power portfolio
NEDO approves Rapidus’ FY2024 Plan and Budget
SK hynix signs Advanced Chip Packaging agreement
Renesas expands Quick Connect Studio
Infineon and Amkor deepen partnership
AP&S establishes site in the USA
Dracula Technologies selected by STMicroelectronics
RAIN RFID data to transform corporate sustainability initiatives
Integrated AMR replaces reed switches and hall effect sensors
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: