+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Lorentz collaborates with Intel Foundry Services

News

Lorentz Solution, provider of Electromagnetic (EM) design platform and simulation solutions, joins the Intel Foundry Services (IFS) Accelerator EDA Alliance to support mutual customers.

PeakView EM IC and 3DIC design tools have been enabled on IFS’s advanced process nodes with early customer access. As part of IFS’s Accelerator EDA Alliance, Lorentz will provide cutting-edge electromagnetic simulation, synthesis, extraction and analysis technologies to enable customers to reduce design barriers, minimize design risk and cost, and accelerate time-to-market.

The IFS Accelerator EDA Alliance program will make silicon technology available to customers to design innovative chips, and foster collaborative innovation with world-leading EDA, design services and IP partners. As a member of the IFS Accelerator EDA Alliance, Lorentz benefits from early access to process roadmaps, process design kits (PDKs), and technical training. The key highlights are:

• 3D fullwave accuracy through volume meshing, 3D current and charge distribution organized under Maxwell equations;

• Accuracy, high capacity and large scale provided by PeakView’s dual solvers: FlatEM and HCS;

• EM prototyping: circuit-level EM isolation, coupling and crosstalk modeling and simulation during design stage and before LVS clean.

“The addition of Lorentz’ Peakview enablement with IFS’s advanced nodes reinforces IFS’s commitment to providing a best-in-class design ecosystem for our customers,” said Suk Lee, VP of Design Ecosystem Development at IFS. “Partnering with Lorentz enables us to continue to deliver cutting-edge silicon design capabilities for current and next-generation RF, mmWave and high-speed circuit designs.”

“As the most designer-focused and innovative EM solution, PeakView achieves 3D DC-mmWave-TeraHz fullwave accuracy and large-scale simulation capability for IC, 3DIC and IC-PKG-PCB designs,” said Jinsong Zhao, President and Founder of Lorentz Solution. "As IFS continues to advance its process nodes and advanced packaging technology, it is a privilege to partner with IFS as one of the leading EDA vendors with our deep EM expertise and PDK integration. We are grateful for this opportunity and look forward to delivering high-quality EDA tools and simulation solutions for RF, mmWave and high-speed designs."

As a part of IFS Accelerator EDA Alliance program, Lorentz’ PeakView EM IC and 3DIC Design platform, will support customers and spur their innovation, playing a key role in the success of RF, mmWave and high-speed analog EM IC designs.

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: