+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Supporting data-intensive workloads

News

Ayar Labs shipping in-package optical I/O solutions with sub-10 nanoseconds (ns) latency and sub-10 Watts of power needed for leading semiconductor, AI/HPC and aerospace customers to support next-generation data-intensive workloads.

Ayar Labs has announced public demonstration of the industry’s first 4 terabit-per-second (Tbps) bidirectional Wavelength Division Multiplexing (WDM) optical solution at the Optical Fiber Communication Conference (OFC) in San Diego on March 5-9, 2023. The company achieves this latest milestone as it works with leading high-volume manufacturing and supply partners including GlobalFoundries, Lumentum, Macom, Sivers Photonics and others to deliver the optical interconnects needed for data-intensive applications. Separately, the company was featured in an announcement with partner Quantifi Photonics on a CW-WDM-compliant test platform for its SuperNova™ light source, also at OFC.

In-package optical I/O uniquely changes the power and performance trajectories of system design by enabling compute, memory and network silicon to communicate with a fraction of the power and dramatically improved performance, latency and reach versus existing electrical I/O solutions. Delivered in a compact, co-packaged CMOS chiplet, optical I/O becomes foundational to next-generation AI, disaggregated data centers, dense 6G telecommunications systems, phased array sensory systems and more.

“In-package optical I/O solutions have the potential to transform how semiconductor, AI, HPC and aerospace customers process their next-generation, data-intensive workloads,” said Craig Thompson, vice president of Business Development for Networking at NVIDIA. “NVIDIA’s accelerated computing platform is enabled by advanced technologies such as WDM optical interconnects to equip tomorrow’s innovators with the extreme performance they need.”

At OFC, Ayar Labs will have a first public demonstration showing its optical I/O solution moving data from one TeraPHY™ optical I/O chiplet to another at 2.048 Tbps each direction powered by their SuperNova light source. SuperNova powers 8 fiber links (using 64 highly accurate wavelengths operating at 32 Gbps, for 8 wavelengths and 256 Gbps per individual fiber) running error free at lower than 10ns of latency and without needing Forward Error Correction (FEC). This allows for a total bandwidth of 2.048 Tbps each direction, or 4.096 Tbps bidirectional. More importantly, the data transfer is using less than 5 pJ/bit (10W), a high level of energy efficiency, providing the power density and performance per watt needed to achieve AI models with trillions of parameters, advanced HPC designs and more.

“Ayar Labs continues to showcase our technology leadership with this live silicon demonstration, an industry-first milestone on the path to overcoming the impending power and performance wall of electrical design, and unleashing the power of next generation compute,” said Charlie Wuischpard, CEO, Ayar Labs. “As we bring together all the supply, manufacturing, test and compute pieces needed for high-volume deployment, we also show today that we continue to lead in pure technical achievement.”

“Revenue generated by Optical I/O for high performance computing (HPC) was around US$5 million in 2022 and is expected to reach US$2.3 billion in 2033 with a 74% Compound Annual Growth Rate for 2022-2033,”(1) explains Martin Vallo, Senior Analyst, Photonics, at Yole Intelligence, part of Yole Group. “Projections of rapidly growing training dataset sizes underline that data will become the main bottleneck for scaling machine learning (ML) models, resulting in a potential slowdown in Artificial Intelligence (AI) progress. Using optical I/O in ML hardware can help overcome this bottleneck, and could be the main driver for its adoption in next-gen HPC systems.”

SPEA donates test equipment to university in Thailand
SONOTEC and S3 Alliance join at SEMICON Europa
Luminaries like high-NA EUV and curvilinear photomasks
SensiML and Silicon Technology join forces
TRI launches high-performance 3D AXI
SONOTEC and S3 Alliance join at SEMICON Europa
Marquee Semiconductor expands Indian presence
Micron begins Memory Manufacturing Fab
SiLC Technologies advances Machine Vision
Renesas partners with EdgeCortix
Gradiant acquires H+E Group
Webinar: Hydrogen Generation Industry Innovations to Meet Expanding North American Fab Hydrogen Requirements
EdgeCortix set to disrupt the edge market?
Evonetix places first DNA Synthesis Development Platform at Imperial College London
ASE launches Integrated Design Ecosystem
Cohu acquires Equiptest Engineering
Advantest wins 2022 Best Supplier Award from ASE Holdings
SEMI welcomes new board members
Advanced Energy breaks ground on flagship factory
GlobalFoundries opens new Malaysia office
TSMC reveals 'breakthrough' set to redefine the future of 3D IC
Delphon announce new VP, strategic marketing & business development
Particle Measuring Systems Announces Acquisition of EMS
Ireland begins high-volume production of Intel 4 Technology
Advantest to showcase latest test solutions
200 gigabits per second
KemLab Inc. applauds CHIPS Act's commitment
200mm fabs to reach record capacity by 2026
Governor DeSantis dedicates $50 million for workforce development
DOD names eight 'Microelectronics Commons' Hubs
TSMC accelerates renewable energy adoption
Mouser signs global agreement with MediaTek
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: