+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

SRC publishes microelectronics and advanced packaging roadmap

News

Semiconductor Research Corporation (SRC) has released an interim report for the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap.

The roadmap is a far-reaching initiative for the semiconductor industry that, to date, has involved the participation of over 100 organizations of all sizes representing government, academia, and industry.

This multi-chapter roadmap is the result of a $300,000 competitively-selected award granted to SRC by the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) in April 2022. SRC was the only awardee chosen to focus on these emerging technologies, due to its strong history of thought leadership and continued innovation.

The report introduces a new comprehensive roadmap to guide the forthcoming microelectronic revolution, similar to how the International Technology Roadmap for Semiconductors (ITRS) served the industry in the past. The MAPT roadmap represents the inevitable shift of microelectronics from the historical two-dimensional (2D) device-centric paradigm to a future that exploits 3D and heterogeneous integration to seamlessly integrate multiple chiplets that enable complex System-in-Package platforms. The new paradigm uses system-scale design and architecture to integrate electronics, photonics, and micromechanical chiplets, taking into account cross-platform issues and relying critically on the rise of advanced packaging technologies.

SRC Chief Scientist and Director of the MAPT Roadmap, Dr. Victor Zhirnov, commented, “This roadmap was created for use by the community to fortify the semiconductor supply chain and bolster emerging applications that will only be achieved if we can work together." Key partners for the governance of this roadmap include representatives from AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton, and the Georgia Institute of Technology. Minority Serving Institutions (MSI’s), such as Morgan State University and Howard University, have shared valuable perspectives that are helping the roadmap be more comprehensive, creating a more inclusive atmosphere to unlock the talents inherent in all of us.

The MAPT roadmap is rooted in the SRC-published 2030 Decadal Plan for Semiconductors. It projects 10-15 year targets and timelines for both semiconductor manufacturing technologies and workforce development, highlighting opportunities and solutions for the identified targets.

SRC is actively seeking public feedback on the interim MAPT roadmap. The interim report and instructions for public comments can be found at https://srcmapt.org/. The comments period for collecting feedback will close May 1, 2023. The MAPT roadmap will be finalized and become public in October 2023.

Tektronix and EA Elektro-Automatik offer expanded power portfolio
83% of supply chains can’t respond to disruptions in 24 hours
CMC Microsystems and ventureLAB sign MoU
Renesas introduces FemtoClock 3 timing solution
Mycronic receives order for SLX mask writer
Rapidus reveals US subsidiary and opens Silicon Valley office
Infineon introduces news MOTIX motor gate driver IC
Brewer Science unveils Smart Warehouse Monitor System
Symposium to showcase breakthroughs in microelectronics
CHIPS for America promotes over $50 million funding opportunity
SEMI University launches in-person courses
Samsung Electronics to establish Texan semiconductor ecosystem
Semiconductor chips drive innovation in AI and industries
Semiconductor equipment sales slip to $106.3 billion
Mouser Electronics receives 2023 Global Best Service Distributor of the Year Award from Diodes Incorporated
Quantum processor testing and measurement facilities up and running
Semiconductor Research Corporation announces 2024 call for research
Trend report unveils the future of circular electronics
PCIM Europe 2024: highlights and new records
PI contributes to technology node development
QP Technologies achieves ANSI/ESD S20.20 Certification
Renesas commences operations of Kofu Factory
TRI wins three Innovation Awards
Tektronix and recently acquired EA Elektro-Automatik offer expanded power portfolio
NEDO approves Rapidus’ FY2024 Plan and Budget
SK hynix signs Advanced Chip Packaging agreement
Renesas expands Quick Connect Studio
Infineon and Amkor deepen partnership
AP&S establishes site in the USA
Dracula Technologies selected by STMicroelectronics
RAIN RFID data to transform corporate sustainability initiatives
Integrated AMR replaces reed switches and hall effect sensors
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: