memsstar to support Walther-Meißner-Institut
Ships ORBIS™ Alpha XERIC™ MEMS oxide etch system for research and manufacturing.
memsstar has shipped its ORBIS™ Alpha XERIC™ oxide etch system for MEMS research and manufacturing to Germany’s Walther-Meißner-Institut for Low-Temperature Research (WMI). memsstar’s surface micromachining tool will be implemented as a central unit for micromechanical structuring of MEMS components, from single chips up to 200mm wafers.
WMI will use the systems to help develop next-generation quantum devices. The institute’s multifaceted research groups plan to employ memsstar vapour-phase hydrogen fluoride etching in their fabrication processes. Target processes include stiction-free release of micro- and nano-mechanical devices for quantum sensing applications. WMI also plans to employ the memsstar tool and processes to fabricate superconducting quantum circuits – in particular, quantum-bits (qubits), the basic building blocks of quantum computers.
Dr. Stefan Filipp, Ph.D., director of WMI, commented, “We selected the memsstar ORBIS Alpha XERIC oxide etch system to obtain the best etch process capabilities for investigating novel approaches in designing high-quality quantum devices.”
“This project strongly showcases ORBIS’s capabilities and our approach to working with our customers to develop processes that address their specific requirements,” said memsstar CEO Tony McKie. “The truly leading-edge work being done at WMI requires our technology’s advanced control and capabilities to meet their varied application requirements.”
The ORBIS Alpha platform is an enabling technology for research of next-generation MEMS and nanodevices. It also includes fully integrated process monitoring and endpoint control and proven hardware that delivers excellent uniformity and repeatability. Designed for R&D facilities, ORBIS Alpha is based on memsstar's production-proven continuous-flow processing technology. This combination of benefits enables advanced process development on a cost-effective platform.
