+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

NIO and NXP collaborate on 4D imaging radar deployment

News

NXP’s imaging radar technology enables NIO to achieve high-level autonomous driving through vastly improved sensor resolution and extended detection range.

NIO Inc., a leading brand in the global premium smart electric vehicle market, will leverage NXP’s leading automotive radar technology, including its ground-breaking imaging radar solution. NXP’s latest 4D imaging radar solution is a powerful technology that allows benefits far beyond traditional radar. It will enable a significant improvement in front radar performance in today’s vehicles. The cars will be able to detect and classify objects such as other vehicles and vulnerable road users in high-way and complex urban scenarios and at distances of up to 300m, bringing more safety to the roads and driving comfort for end users.

OEMs increasingly focus on the introduction of safety and convenience features to take autonomous driving services to the next level. NXP’s imaging radar technology expands radar’s capabilities from measuring range and speed, to include direction, angle of arrival, and elevation measurement. Fine-resolution point clouds enhance environmental mapping and scene understanding, enabling the detection and classification of objects beyond the range of human eyesight while measuring the objects’ velocity under almost all weather and light conditions. The technology is a key step in improving road safety and saving lives, it allows the car to ‘see’ a motorcycle driving close to a large delivery truck or a child entering a roadway between parked cars.

NXP’s imaging radar solutions are said to be the ideal choice for advanced, high-performance front radar applications. Being part of NXP’s full range of radar products, they offer seamless performance scalability as well as software and hardware design reuse across radar platforms. The combined radar processor and transceiver chipsets deliver efficient advanced radar processing with high-performance RF technology, enabling Level 2+ and higher autonomous driving services.

“NIO is committed to providing users with a vehicle experience that exceeds expectations. Carmakers developing high-level, assisted intelligent driving experiences is a key element of that,” said Kevin Pan, Assistant Vice President of NIO Supply Chain Development. “Together with NXP, we’ll be able to take the next step toward improving driver experiences.”

“NXP’s imaging radar technology offers high-resolution object and feature detection for precisely mapping the car’s surroundings, enabling carmakers to deliver improved ADAS and autonomous driving features,” stated Torsten Lehmann, EVP and GM, Radio Frequency Processing, NXP. “NIO’s decision to adopt NXP 4D imaging radar technology is a testament to its differentiating performance and efficiency.”

UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
Purdue establishes permanent presence next to NSWC Crane
Bolstering semiconductor ecosystem at Texas A&M University
Semiconductor industry sees revenue increase for the first time since 2021
Bosch completes TSI Semiconductors acquisition
Semiconductor grants for undergraduate women
Sustainability rises up the automotive agenda
Lumibird completes Prima acquisitions
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: