Nordson’s advanced packaging solutions at SEMICON Taiwan 2023
See the Nordson Electronics Solutions equipment and talk to experts about the latest in fluid dispensing for semiconductor packaging at booth #L0800.
Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor. At the booth, you will see these systems:
The popular ASYMTEK Vantage® fluid dispensing system, Nordson’s most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet® valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
The newest ASYMTEK Forte® fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuit, MEMs, and electromechanical applications.
Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.
