+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Aqua Membranes collaborates with Micron Technology


Semiconductor pilot shows 20 percent energy savings and four-times lower water fouling for piloted membranes.

Aqua Membranes, a water technology company specializing in sustainable reuse, is sharing preliminary results of an ongoing pilot project with memory chip giant, Micron Technology, Inc. Pilot implementation included a head-to-head comparison between Aqua Membranes’ Printed Spacer Technology® and a standard reverse osmosis (RO) with traditional mesh element architecture at Micron’s Boise, Idaho fabrication plant, with the base RO membrane type being the same for both cases. With the Printed Spacer Technology, the teams observed a 20 percent drop in overall system energy consumption after four months of continuous operation of the pilot. The feed to reject pressure drop (dP), a measurement used to gauge water fouling in RO applications, also significantly improved, averaging 6.03 pounds per square inch (PSI) with mesh versus 0.6 PSI with printed spacers.

In 2021, Micron invested in Aqua Membranes to help accelerate the development of their Printed Spacer Technology in microelectronics applications. Micron plans to continue testing Printed Spacer Technology in different RO applications and evaluate performance against other commercially available membranes for its full-scale systems.

“Utilizing Aqua Membranes’ components in our RO water treatment systems to reduce energy consumption and the associated emissions supports Micron’s ongoing commitment to sustainability improvements, while maintaining our stringent quality standards,” said Elizabeth Elroy, vice president of Global EHS and Sustainability at Micron. “Through two years of continuous development, we are thrilled to see our collective efforts and hard work paying off, and we’re grateful for our collaboration with Aqua Membranes to help us move towards this goal.”

The pilot system is comprised of two identical units running in parallel, which allows the Printed Spacer Technology to run in direct comparison with mesh spacers employed in the same RO skid. Variable frequency drives (VFD) are used to adjust primary pressure on each system and maintain a constant 63 gallons per minute (GPM) of product water at a recovery rate of 65 percent from the 16 element systems. Banking was 3:1 with four vessels total and four elements per vessel.

A slower rate of fouling allows for longer intervals between cleaning, which results in lower maintenance costs and extends the longevity of the membrane life. This, combined with the lower energy consumption, means Aqua Membranes’ Printed Spacer Technology elements show potential to significantly lower the cost of RO membrane operation. With the success of the Boise pilot, Micron is exploring usage of Aqua Membranes’ Printed Spacer Technology elements in its high volume fabs, including at its planned facility in Clay, New York.

Tektronix and EA Elektro-Automatik offer expanded power portfolio
83% of supply chains can’t respond to disruptions in 24 hours
CMC Microsystems and ventureLAB sign MoU
Renesas introduces FemtoClock 3 timing solution
Mycronic receives order for SLX mask writer
Rapidus reveals US subsidiary and opens Silicon Valley office
Infineon introduces news MOTIX motor gate driver IC
Brewer Science unveils Smart Warehouse Monitor System
Symposium to showcase breakthroughs in microelectronics
CHIPS for America promotes over $50 million funding opportunity
SEMI University launches in-person courses
Samsung Electronics to establish Texan semiconductor ecosystem
Semiconductor chips drive innovation in AI and industries
Semiconductor equipment sales slip to $106.3 billion
Mouser Electronics receives 2023 Global Best Service Distributor of the Year Award from Diodes Incorporated
Quantum processor testing and measurement facilities up and running
Semiconductor Research Corporation announces 2024 call for research
Trend report unveils the future of circular electronics
PCIM Europe 2024: highlights and new records
PI contributes to technology node development
QP Technologies achieves ANSI/ESD S20.20 Certification
Renesas commences operations of Kofu Factory
TRI wins three Innovation Awards
Tektronix and recently acquired EA Elektro-Automatik offer expanded power portfolio
NEDO approves Rapidus’ FY2024 Plan and Budget
SK hynix signs Advanced Chip Packaging agreement
Renesas expands Quick Connect Studio
Infineon and Amkor deepen partnership
AP&S establishes site in the USA
Dracula Technologies selected by STMicroelectronics
RAIN RFID data to transform corporate sustainability initiatives
Integrated AMR replaces reed switches and hall effect sensors
Search the news archive

To close this popup you can press escape or click the close icon.
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: