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Accelerating next-generation advanced packaging applications


Adeia Inc., a leading semiconductor R&D innovator, has chosen the WaferStorm® Wet Processing Systems for advanced packaging applications.

The system was recently installed in Adeia’s San Jose, CA facility to enable key hybrid bonding cleaning processes for continued 2.5/3D package technology development.

“We are excited to partner with Veeco, a company that shares our vision for accelerating innovative technologies that improve worldwide connectivity,” said Dr. Laura Mirkarimi, Sr. Vice President of Engineering at Adeia. “With the installation of this WaferStorm system, Adeia now has a high-pressure spray technology that offers low defectivity as we scale production of next-generation hybrid-bonded advanced packaging modules.”

According to Yole Group, the advanced packaging market is expected to surpass $78 billion by 2028, growing at a CAGR of 10% from 2022 to 2028. Yole analysts note that the primary contributors to the market are flip-chip, 2.5D/3D, and silicon phosphide, which will account for over 90% of the market by 2028. The top three platforms experiencing the highest growth rates in this segment are ED, 2.5D/3D, and flip-chip.

“We are proud to collaborate with Dr. Mirkarimi and her team at Adeia, a world-class innovator in the semiconductor technology sector,” commented Mathew Abraham, Vice President of Marketing for Veeco’s Wet Processing Product Line. “The WaferStorm wet processing platform is uniquely qualified to take key process steps from development to high-volume manufacturing. Our wet processing systems enable next-generation advanced packaging in large part because of our proprietary ImmJET™ solvent technology, a combination of batch immersion and single wafer spray processing that delivers superior process capabilities and low cost of ownership for photoresist strip and temporary bonding removal applications. We look forward to partnering with Adeia to accelerate advanced packaging adoption in the markets they serve.”

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