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Empower Semiconductor expands European sales

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Empower Semiconductor has announced a representation and distribution agreement with Dimac Red Spa, a professional sales and engineering organization dedicated to serving the European market with innovative and high-reliability electronics products, design services and engineering consultancy.

Headquartered near Milan, Italy, with regional offices in Germany, France, United Kingdom, Spain, and Turkey, Dimac Red will serve as representative and European distributor for the Empower IVR and ECAP products. This collaboration is poised to accelerate market penetration and enhance accessibility to Empower’s innovative solutions for customers throughout Europe.

“This partnership reinforces our ability to deliver best-in-class products and a unique level of technical support to customers across a larger geography,” stated Eric Pittana, senior director of global marketing and EMEA sales for Empower Semiconductor. “Our IVR solutions are gaining significant momentum in applications where space is at a premium and high performance is required. Along with Dimac Red, we share the same commitment to be a solution provider to our focus markets in embedded systems, telecom and medical.”

According to Marco Di Bartolo, Dimac Red CEO, “We are excited to partner with Empower Semiconductor. Their technology achieves a level of power density, performance and simplicity that represents an unparalleled value to our customer base. Together, we look forward to driving innovation, and exceeding the expectations of our customers.”

Empower IVR technology features a novel and advanced power management architecture that delivers power with simplicity, speed and accuracy in a compact single IC with no external discrete components. These devices can be used for traditional system power in space-constrained applications as well as integrated as a power chiplet into an SoC or chiplet-based architecture. Combined with Empower’s ECAP silicon capacitor products, in-package IVRs achieve an unprecedented level of compactness, performance and power integrity.

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