+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

OMNIVISION launches newest Global Shutter Image Sensor


OG0TC is the first global shutter image sensor for AR/VR/MR with OMNIVISION’s on-chip single-exposure DCG™ technology for ghost-free high dynamic range imaging.

OMNIVISION has introduced the new OG0TC BSI global shutter (GS) image sensor for eye and face tracking in AR/VR/MR consumer headsets and glasses. For the first time ever, OMNIVISION is bringing its patented DCG™ high dynamic range (HDR) technology to the AR/VR/MR market in the 2.2-micron (µm) pixel OG0TC GS image sensor.

With a package size of just 1.64mm x 1.64mm, the OG0TC is an ultra-small and low-power image sensor for optimizing primarily inward-facing tracking cameras. This small form factor is key to industrial designs as multiple cameras are required for tracking all aspects of the face (eyes, brows, lips, etc.). The OG0TC is pin-to-pin compatible with OMNIVISION’s previous-generation BSI GS image sensor for easy upgrades.

“Ultra-low power consumption is critical for AR/VR battery-powered devices, and our OG0TC BSI GS image sensor reduces power by more than 40% over our previous-generation OG0TB sensor, which is already an extremely low-power device,” says Devang Patel, marketing director – IoT/Emerging, OMNIVISION. “Pin-to-pin compatibility makes the upgrade to the OG0TC easy for our customers, so they do not need to make any change to their design to save power and enjoy new features like DCG™ technology.”

Key features of the OG0TC image sensor include:

● The sensor is built on OMNIVISION’s PureCel®Plus-S stacked-die technology.

● It features OMNIVISION’s patented DCG™ HDR technology and offers 400x400 resolution with a 2.2µm pixel in a 1/14.46-inch optical format.

● Nyxel® technology enables the best quantum efficiency at the 940nm near-infrared (NIR) wavelength for sharp, accurate images of moving objects.

● It consumes less than 40% of the power at 30 frames per second (fps) compared with the previous-generation sensor.

● The sensor’s high modulation transfer function enables sharper images with greater contrast and more detail.

● It supports a flexible interface, including MIPI with multi-drop, CPHY, etc.

Patel adds, “We are excited to introduce our single-exposure DCG™ HDR technology for ghost-free image capture to the AR/VR market. It already has proven to be extremely successful in the security, mobile and automotive industries.”

Pankaj Kukkal reelected Board Chair Of Silicon Integration Initiative
OMNIVISION launches newest Global Shutter Image Sensor
ISE Labs expands capabilities, doubles lab space
Motorola Solutions opens Global R&D Centre in Ireland
Thermo Fisher Scientific opens Electron Microscopy Demo Centre in Taiwan
Lightning Mode added to QUADRA metrology system
DENTRESSANGLE Capital to acquire Presto Engineering
JST wins front-end cleaning order
Resonac unveils new US-JOINT Consortium
Advantest to showcase latest test technology at SEMICON West
Advanced Energy introduces power and measurement solutions
Nordic Semiconductor recognised for greenhouse gas milestone
Ansys enables 3D multiphysics visualisation
Wave Photonics launches QPICPAC Chip Packaging solution
GlobalFoundries acquires Tagore Technology’s GaN technology
Nordic Semiconductor named as one of “World’s Most Sustainable Companies”
Lattice introduces Secure Control FPGA family
EV Group tops customer rankings
scia Systems highlights advances in ion beam processing
Seica to showcase Advanced Flying Probe Test System Pilot VX
Keysight streamlines and automates Samsung's 5G Field-to-Lab Workflow
International power electronics conference comes to South Wales
INFICON launches three extensions for more efficient helium leak detection
Nordic Semiconductor launches new component reels made from recycled plastics
Better throughput and quality for high-precision laser processes
Trident IoT introduces new Zigbee Chip and SDK
TRI expands with new office in Guadalajara, Mexico
Omdia research finds weak demand leads to declining quarter for semiconductor market
BAE Systems and GlobalFoundries collaborate
Custom CMOS image sensor design on a budget
Radiation hard CMOS sensor for satellite instrument
Data centre semiconductor market sees significant growth
Search the news archive

To close this popup you can press escape or click the close icon.
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: