Microelectronics US 2026 showcases practical solutions
Taking place April 22–23 at the Palmer Events Center in Austin, the conference content is built around the constraints engineers are working within today — from performance, power and thermal limits, to safety certification, security, manufacturability and long-term reliability.
Rather than abstract roadmaps, sessions focus on how these challenges are being addressed in practice across automotive, industrial, aerospace, defense, communications and infrastructure applications.
Engineering problems at the center of the agenda
Across dedicated content stages, Microelectronics US will explore topics including:
Advanced packaging, chiplets and 3D-ICs to overcome performance bottlenecks
Designing and verifying safety-critical and mission-critical systems
Deploying embedded AI and ML at the edge while managing latency, security and compliance
Scaling photonics for data centers, sensing, space and communications
Managing thermal density, materials constraints and energy efficiency
Building resilient systems for harsh and high-reliability environments
Translating policy, investment and supply-chain shifts into engineering decisions
Sessions bring together perspectives from OEMs, tier-one suppliers, fabs, design houses and research organizations, ensuring discussions reflect real deployment environments.
End-user insight grounded in real applications
The agenda features end-user engineers and technical leaders from major automotive, industrial, aerospace and technology organizations including Ford, General Motors, Stellantis, Honeywell, Cummins, and Arm.
These perspectives keep discussions focused on real engineering trade-offs — balancing performance, safety, cost, manufacturability and time-to-market — and give attending engineers insight they can directly apply within their own programs.
Solutions across the microelectronics supply chain
The exhibition connects these challenges with solution providers across the microelectronics ecosystem. Confirmed exhibitors include organizations spanning embedded platforms, AI development tools, photonics technologies, materials, manufacturing equipment, test and measurement, and design enablement.
Companies confirmed to date include Edge Impulse (Headline Sponsor), Keyence, YieldWerx, Innofocus Photonics Technology, Synergie CAD, Vision Engineering, Pickering, TQ Systems, Drake Plastics, FemtoAI, Octagon, IC Resources, NTX Embedded, Grinn Global, Graphene, Tex Air Filters, Keywave, Malico Inc, and the Welsh Government, among others — with additional exhibitors to be announced.
The show floor is designed to reflect the full range of technologies engineers rely on, from design through manufacturing, testing and deployment.
The Talent Foundry
On the afternoon of April 23, the Photonics Theater will host the Talent Foundry, a dedicated program designed to address one of the industry’s most pressing challenges: access to skilled, job-ready engineering talent. The Talent Foundry brings students and early-career engineers together with industry experts in small, roundtable discussions focused on career pathways, skills development, and real-world engineering insight, creating meaningful connections between emerging talent and the companies building next-generation microelectronics technologies.
