Advantest to showcase latest test solutions at SEMICON China 2026 in Shanghai
At this year’s event, Advantest will highlight its broad portfolio of leading-edge test technologies for applications such as high-performance computing (HPC), advanced memory and power electronics, as well as the company’s sustainability initiatives.
Product and Solution Highlights
Advantest’s product display will be located at booth #N4431, featuring the company’s comprehensive portfolio of test solutions that address industry challenges in the era of complexity, including: - Solutions for the V93000 EXA Scale test system, including the DUT Scale DUO advanced DUT interface solution, optimized for high rigidity and extended space with full backward compatibility. - A high-speed memory test interface solution, including the T5801 Ultra-High-Speed DRAM test system, engineered to support the latest advancements in high-speed memory technologies – including GDDR7, LPDDR6, and DDR6. - A new scalable MTe test platform designed for next-generation wide-bandgap technologies (like SiC and GaN) to deliver uncompromising performance: ultra-fast signal capture, precision gate driver control, dynamic and short-circuit testing up to 10kA, flexible high-voltage digital capabilities and a compact footprint. - CD-SEM tools for testing sub-2nm semiconductor photomasks, such as the E3660, engineered for the dimensional metrology of photomasks and EUV masks.
Presentations
In addition to product displays, Advantest will also participate in this year’s technical program. Various speakers from Advantest will be featured in SEMICON China’s Conference for Science and Technology for Integrated Circuits (CSTIC), presenting on topics such as scan test, Analog-to-Digital Converter (ADC) test, real-time machine learning (ML) and many more.
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