MIRTEC to showcase 3D Semiconductor Inspection System at SEMICON West 2026
The MV-9SiP Hybrid 3D Inspection System combines 2D vision, 12-projection Digital Blue Light Moiré, and Blue Laser Scanning in a single semiconductor inspection platform. Its proprietary 25MP CoaXPress vision system with 7.7µm resolution precisely inspects 01005 chip arrays, solder balls, bumps, and densely packed packages. The 8-phase coaxial color lighting enhances crack and surface-defect visibility on reflective CSP components, while the blue laser scanner reliably measures highly reflective and low-reflective surfaces.
Commitment to Smart Manufacturing
“MIRTEC remains committed to advancing inspection technology and delivering reliable solutions for the evolving needs of electronics manufacturers,” said Roony Kim. “By combining high-precision inspection, AI-driven innovation, and extensive industry expertise, we continue to support demanding applications across the automotive, aerospace, and defense sectors while helping manufacturers achieve greater quality, productivity, and process reliability.”
