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IC Test Equipment Company Advantest Plans To Develop A Fast, Accurate

IC test equipment company Advantest plans to develop a fast, accurate failure diagnostics solution for deep-submicron, high-speed system-on-chip (SoC) designs using TetraMAX automatic test pattern generation (ATPG) technology from electronic design automation (EDA) tool provider Synopsys. The tool under development will use data communication between the company's T6000 series ATE system and Synopsys' TetraMAX ATPG tool to streamline the process of detecting failures.
The tool is due for formal introduction in
September this year. In addition, Advantest has implemented these failure
diagnostic methods on its e-beam test system. Linking fault localisation
information and design information will enable more precise and accurate
failure area and defect factors to be specified.

Amkor Technology is to take delivery of 100 fine pitch wire bonders during
May and June from Kulicke & Soffa Industries and ASM Pacific. The tools are
rated at 50micron pitch bond pad capability to support semiconductor devices
fabricated to 0.18micron and tighter design rules.

Indian medical devices retailer and distributor BL Marketing Services will
distribute MEMSCAP sensor-based medical products in India. The first order
placed by BL Marketing Services for disposable blood pressure products is
worth $1.325m over three years.


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VIEW SESSIONS
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
EV Group Establishes State-of-the-art Customer Training Facility
Panasonic Microelectronics Web Seminar
Onto Innovation Announces New Inspection Platform
Changes In The Management Board Of 3D-Micromac AG
AP&S Expands Management At Beginning Of 2021
DISCO's Completion Of New Building At Nagano Works Chino Plant
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Will Future Soldiers Be Made Of Semiconductor?
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
TEL Introduces Episode UL As The Next Generation Etch Platform
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
ITRI And DuPont Inaugurate Semiconductor Materials Lab
ASML Reports €14.0 Billion Net Sales
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
SUSS MicroTec Opens New Production Facility In Taiwan
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
K-Space Offers A New Accessory For Their In Situ Metrology Tools
New Plant To Manufacture Graphene Electronics
Cadence Announces $5M Endowment To Advance Research

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