IC test equipment company Advantest plans to develop a fast, accurate failure diagnostics solution for deep-submicron, high-speed system-on-chip (SoC) designs using TetraMAX automatic test pattern generation (ATPG) technology from electronic design automation (EDA) tool provider Synopsys. The tool under development will use data communication between the company's T6000 series ATE system and Synopsys' TetraMAX ATPG tool to streamline the process of detecting failures.

The tool is due for formal introduction in
September this year. In addition, Advantest has implemented these failure
diagnostic methods on its e-beam test system. Linking fault localisation
information and design information will enable more precise and accurate
failure area and defect factors to be specified.

Amkor Technology is to take delivery of 100 fine pitch wire bonders during
May and June from Kulicke & Soffa Industries and ASM Pacific. The tools are
rated at 50micron pitch bond pad capability to support semiconductor devices
fabricated to 0.18micron and tighter design rules.

Indian medical devices retailer and distributor BL Marketing Services will
distribute MEMSCAP sensor-based medical products in India. The first order
placed by BL Marketing Services for disposable blood pressure products is
worth $1.325m over three years.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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