Plasma Strip For Low-k
The stand-alone ES3Lk is claimed as the industrys first plasma stripping system to provide a zero-damage process for low-k materials, capping layers and etch stops used in low-k integration schemes proposed for use through to the 45nm technology node.
Conventional dry cleaning processes introduce latent damage in low-k materials, leading to adverse changes in the dielectric and the materials physical properties. These changes are especially evident after a wet cleaning step.
Axcelis reports that the new tool is the result of several years of focused R&D activity and extensive field verification. Compatible with subsequent wet cleaning steps, the ES3Lk process can be used with “virtually” all dense and porous low-k materials, allowing customers to extend the process across several technology generations.
The system is based on Axcelis FusionES3 plasma ashing platform. The ES3Lk has a downstream microwave chamber to provide consistent strip rates, high process uniformity and excellent selectivity to low-k materials, while integrated load lock chambers ensure process integrity.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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