Oxford Instruments Plasma Technology
OIPT has always been involved in processing compound semiconductor devices, and this remains a major market today. Despite the global slowdown in communications components, other sectors remain strong, in particular LED manufacture. Other areas of the photonics market are also served, including waveguide and laser fabrication in various materials. OIPT also has experience in processes for manufacturing a range of other optical devices, ranging from micro-lenses to extremely high precision mirrors and filters.
This broad range of process experience has provided a good base for MEMS technology. Not only was the original deep silicon etch process developed on an OIPTsystem (at the university of Regensburg), but a wide range of other MEMS fabrication techniques are available and in use around the world.
Failure Analysis is another significant process technology available from OIPT, with FA tools being used by many of the largest names in the semiconductor industry.
The original OIPT systems were small, open-load systems suitable for R&D. As the processes developed on these systems have matured, so have the systems available from OIPT, so now the small systems are part of a range reaching up to cassette-to-cassette multi-chamber clusters designed for production environments.
The range of experience in these and other diverse fields has led many companies and organisations to call OIPT their “Partners in Process”.
OIPT has always been involved in processing compound semiconductor devices, and this remains a major market today. Despite the global slowdown in communications components, other sectors remain strong, in particular LED manufacture. Other areas of the photonics market are also served, including waveguide and laser fabrication in various materials. OIPT also has experience in processes for manufacturing a range of other optical devices, ranging from micro-lenses to extremely high precision mirrors and filters.
This broad range of process experience has provided a good base for MEMS technology. Not only was the original deep silicon etch process developed on an OIPTsystem (at the university of Regensburg), but a wide range of other MEMS fabrication techniques are available and in use around the world.
Failure Analysis is another significant process technology available from OIPT, with FA tools being used by many of the largest names in the semiconductor industry.
The original OIPT systems were small, open-load systems suitable for R&D. As the processes developed on these systems have matured, so have the systems available from OIPT, so now the small systems are part of a range reaching up to cassette-to-cassette multi-chamber clusters designed for production environments.
The range of experience in these and other diverse fields has led many companies and organisations to call OIPT their “Partners in Process”.

AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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