Motorola Labs is take delivery of a "Imprio 100" step and flash imprint lithography (S-FIL) system from Molecular Imprints. The Lab will use the tool to perform device research in the areas of novel devices, compound semiconductors, molecular electronics, and photonic and optical devices. Laura Siragusa, director of Advanced Processing/Characterization at Motorola Physical Sciences Research Laboratories, reports that the two companies have been working together for two years, and now hope to realise a breakthrough in a lithographic technique that will enable smaller, faster future devices. The Imprio 100 is claimed to be capable of creating sub-100nm images. S-FIL is a bi-layer approach using a low-viscosity, UV-curable liquid-etch barrier deposited on an underlying transfer layer. The template is rigid and transparent allowing for UV curing of the etch barrier and the adaptation of traditional layer-to-layer alignment techniques.

Motorola Labs is take delivery of a "Imprio 100" step and flash imprint
lithography (S-FIL) system from Molecular Imprints. The Lab will use the
tool to perform device research in the areas of novel devices, compound
semiconductors, molecular electronics, and photonic and optical devices.
Laura Siragusa, director of Advanced Processing/Characterization at Motorola
Physical Sciences Research Laboratories, reports that the two companies have
been working together for two years, and now hope to realise a breakthrough
in a lithographic technique that will enable smaller, faster future devices.
The Imprio 100 is claimed to be capable of creating sub-100nm images. S-FIL
is a bi-layer approach using a low-viscosity, UV-curable liquid-etch barrier
deposited on an underlying transfer layer. The template is rigid and
transparent allowing for UV curing of the etch barrier and the adaptation of
traditional layer-to-layer alignment techniques.
Molecular Imprints has exclusive license, for the lifetime of the patents,
to develop and use S-FIL technology, which was invented at the University of
Texas at Austin under the direction of Professors Grant Willson and SV
Sreenivasan.

The first-generation tool is manual and designed for small-volume
manufacturing, R&D, and process, material and template development. It is
capable of handling wafer sizes from 50-200mm. The next-generation system,
expected in 2004, will be capable of throughputs that will meet
production-volume expectations.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

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We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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