Austriamicrosystems’ board of directors has approved a capital investment plan to extend the wafer capacity in its new 200mm fab.

Austriamicrosystems says this will allow it to respond to increasing demand for products based upon its specialised foundry processes from Q3 2003 onwards.

In addition to new equipment, austriamicrosystems is adding fab automation software, computer systems and other capabilities to support improvement of factory efficiency and production capacity. The company is aiming at a 2500 wafer starts per week (WSPW) capacity.

austriamicrosystems operates two wafer fabs in Austria, including a 200mm line specialised in analogue mixed signal RF and HV processes at the 08micron and 0.35micron nodes. In addition to CMOS in both geometries austriamicrosystems also offers HV, BiCMOS and SiGe BiCMOS. These processes are already available in volume production.

austriamicrosystems 0.35micron process family is fully compatible with the mixed signal base process from TSMC. austriamicrosystems has been the only qualified TSMC process licensee partner in Europe since 2001.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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