IBM and Infineon Technologies have succeeded in integrating 128kbit magnetic memory (MRAM) components into a high-performance logic base. The companies hope to accelerate the commercialisation of MRAM possibly replacing some of todays memory technologies as early as 2005. MRAM could lead to instant on computers, allowing users to turn computers on and off as quickly as a light switch.

IBM and Infineon Technologies have succeeded in integrating 128kbit magnetic memory (MRAM) components into a high-performance logic base. The companies hope to accelerate the commercialisation of MRAM possibly replacing some of todays memory technologies as early as 2005. MRAM could lead to instant on computers, allowing users to turn computers on and off as quickly as a light switch.

The MRAM core is fabricated with a 0.18micron logic-based process technology, claimed as the smallest size reported to date for MRAM technology. The MRAM memory cell measures 1.4microns2.

MRAM technology promises significant improvements by storing more information, accessing it faster and using less battery power than electronic memory. The aim is the storage capacity and low-cost of dynamic RAM (DRAM), the high speed of static RAM (SRAM) and the non-volatility of Flash memory.

Dr Wilhelm Beinvogl, chief technology officer (CTO) of Infineon's Memory Product division, comments: "Nonvolatile memory technologies like MRAM will play a major role in technology lifestyle solutions and we want to be the number one semiconductor company in this area by having a product demonstrator jointly developed with IBM available early 2004. Together with Altis Semiconductor, a joint venture of IBM and Infineon, we will pave the way for production readiness of MRAM as early as 2005."

IBM Research pioneered the development of tiny, thin-film magnetic structures as early as 1974. In the late 1980s, IBM scientists made a string of key discoveries about the giant magneto-resistive (GMR) effect in thin-film structures. These developments enabled IBM to create the first super-sensitive GMR read/write heads for hard-disk drives, stimulating dramatic increases in data density. Altering many of the GMR materials enabled IBM scientists to make the magnetic tunnel junctions that are at the heart of MRAM. In November 2000, IBM and Infineon established the joint MRAM development programme.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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