RFID Partnership
The work will be carried out in association with BTG's RFID venture company, RFIP Solutions. The two companies will work together to bring added value to UHF RFID tags and systems. The chip will be a fully-functional read-write RFID transponder optimised for quick, accurate reading in any country. Some 11 developers are promoting the standard for the emerging RFID market. The device will also support the data structures envisaged by the EPC (Auto ID Centre) as well as those developed by the EAN•UCC for identifying individual products and tracking them as they flow through manufacturing plants, distribution centres and retail stores. Tags incorporating the chips developed by Atmel will be used to track and trace items such as pallets, totes, crates, and trading units, in addition to individual item identification. The technology will also be suited to the legal requirements of the European Union.
RFIP Solutions has developed a proof of concept protocol engine, which will be used as a benchmark to ensure that the ISO standard is interpreted in a common and consistent manner. This agreement will allow RFIP Solutions to participate in the commercialisation of the developed products.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE
VIEW SESSIONS
