Info
Info
News Article

MEMS Gas Flow Sensor

Omron of Japan will begin selling its D6F MEMS flow sensor from July 1, 2003. This flow sensor is produced on proprietary micro-electro-mechanical system (MEMS) technology. The company claims that it has produced the world's smallest, supersensitive MEMS technology flow sensor elements realising a size reduction to 1/7th that of flow sensors in the same class.
Omron of Japan will begin selling its D6F MEMS flow sensor from July 1, 2003. This flow sensor is produced on proprietary micro-electro-mechanical system (MEMS) technology. The company claims that it has produced the world's smallest, supersensitive MEMS technology flow sensor elements realising a size reduction to 1/7th that of flow sensors in the same class.


At the heart of the sensor is a heater element. When there is no flow, the temperature distribution around the heater is uniform. When gas flow occurs, the temperature on the flow side of the heater cools, while the side away from the flow warms up - the system is no longer in thermal equilibrium. This difference in temperature is measured as an electromotive force in a thermopile. The mass flow velocity and mass flow rate can hence be measured.


The D6F flow sensor can be used to measure the amount of flammable gas and air needed to achieve complete combustion in hot water boilers. This would control the generation of harmful substances in the combustion process. Reduced energy consumption is also possible. In the field of medicine, this flow sensor could be used to measure the amount of oxygen, nitrogen, and dinitrogen monoxide consumed from a respiratory apparatus in surgery. The company also sees semiconductor processing equipment applications.


Omron will develop the product line-up to encompass a greater flow rate range and a larger variety of gases.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Will Future Soldiers Be Made Of Semiconductor?
New Plant To Manufacture Graphene Electronics
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
EV Group Establishes State-of-the-art Customer Training Facility
Onto Innovation Announces New Inspection Platform
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
ASML Reports €14.0 Billion Net Sales
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
K-Space Offers A New Accessory For Their In Situ Metrology Tools
SUSS MicroTec Opens New Production Facility In Taiwan
Panasonic Microelectronics Web Seminar
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
ITRI And DuPont Inaugurate Semiconductor Materials Lab
DISCO's Completion Of New Building At Nagano Works Chino Plant
TEL Introduces Episode UL As The Next Generation Etch Platform
Changes In The Management Board Of 3D-Micromac AG
AP&S Expands Management At Beginning Of 2021
Cadence Announces $5M Endowment To Advance Research
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Siemens And ASE Enable Next-generation High Density Advanced Package Designs

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event