EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France. The system will be used in collaboration between CEA-LETI and CNRS-LTM on micro- and nanotechnology research in the area of biochip and microfluidic devices.

EV Group (EVG) has shipped and successfully installed a 200mm hot embossing and nanoimprinting system at the CEA-LETI research centre in Grenoble, France. The system will be used in collaboration between CEA-LETI and CNRS-LTM on micro- and nanotechnology research in the area of biochip and microfluidic devices.

The EVG520HE semi-automated hot embossing system creates ultra-fine micrometre and nanometre scale features by pattern transfer from a stamp to a polymer substrate.
Hot embossing is a low cost and flexible fabrication technique, which has demonstrated polymer high aspect ratio microstructures as well as nanoimprinting patterns.

T he EVG520HE also has top- and bottom-heaters for low thermal stress between stamps and substrates and 200mm-substrate capability. The tool is looking for business in new fabrication techniques in the areas of BioMEMS, microfluidics and microoptics.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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