Mergers & Acquisitions
Cirrus will transfer analogue and mixed-signal testers,
handlers and wafer probers to its Chinese facility in exchange for cash and
services. The transaction is expected to close by June 30, 2003.
In addition to the asset transfer, Cirrus Logic and ChipPAC have entered
into a long-term strategic alliance under which ChipPAC will provide package
development, wafer probe, assembly, final test and distribution services.
ChipPAC has more than 5000 employees worldwide with facilities strategically
located in Korea, China and Malaysia, as well as advanced design and
characterisation service centres in California, Arizona and Korea.
"Following an approximate six-month transition period, we expect on-going
cost savings of $1.5-$2.0mn per quarter," says David French, CEO and
president of Cirrus Logic.
The transaction is expected to "impact" approximately 120 Cirrus Logic
employees over a four-month period.
Ashland has signed a definitive agreement to sell the net assets of its
Electronic Chemicals business and certain related subsidiaries to Air
Products in a transaction valued at $300mn before tax. Ashland's after-tax
proceeds will be used primarily to reduce debt. Ashland expects the
transaction to close within 60 days. The agreement calls for Ashland to
provide certain administrative services during the transition period. Air
Products will assume operations at manufacturing and sales facilities upon
closing. The closing is conditional upon a number of standard conditions,
including several regulatory reviews.
Ashland Electronic Chemicals products include strippers for ACT
photoresists, etch residues, low-k dielectrics and copper, copper plating
solutions, chemical mechanical planarisation (CMP) slurries and post-CMP
cleaners. A fab services division provides on-site chemical management,
parts cleaning and tool assembly/ refurbishment.

AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
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We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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