Reorganisation
The company works to develop chip-based optoelectronic
integration. The measure is described as being equivalent to a US Chapter 11
bankruptcy filing. The company is to explore alternative financing
strategies for the company that is suffering from the downturn in the
telecoms sector.
"Our existing financing situation does not allow us to sit through the
current telecom winter," says Wouter Deelman, CEO of ThreeFive Photonics.
Among the possible measures is the sale of the company as a "going
business".
Toshiba plans to set up a new company to provide advanced engineering
support for discrete devices, a major pillar of its semiconductor business.
The new company will start operation in October 2003 with 140 engineers.
This could rise to 170 by 2005.
Discrete devices include power transistors, diodes and opto-devices. The new
company will bring together discrete design and application engineers in a
single location. Device engineers will come from Toshiba LSI System Support.
The activities of the new company will range from device design and
development to engineering for integration in customer systems and products.
Separate divisions will be responsible for the major product areas, such as
telecoms and automotive.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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