Infineon Makes China Deal
Once completed, the facility will have a maximum capacity of up to 1bn chips a year. The new company will operate under the name Infineon Technologies Suzhou with Infineon holding 72.5% percent and CSVC the remaining 27.5%.
The new facility will be developed in a number of stages. Planned investment over ten years will come to $1bn. Registered capital will be $333mn. Infineon will contribute $241.4mn over the next five years as equity. CSVC will contribute $91.6mn.
The first stages of development include construction of the building, facilities, infrastructure and the first cost-intensive equipment. Any further investment would be mostly required for additional equipment. It is expected that the joint venture will finance this externally.
When operating at full capacity, Infineon Suzhou will employ more than 1000 people.
"With this partnership we are systematically expanding our presence in the future market of China, we will gain access to new customers and aim to capture a 40% share of the market for memory products in China," says Infineon president and CEO Dr Ulrich Schumacher. "Overall, we intend to secure in China a place among the top four in the microelectronics business with a market share of more than 10% within the next five years. By then we will have about 3300 employees in China."
Work on constructing the new facility is scheduled to begin in October 2003 and the site should be ready for the equipment installation by mid-2004. Volume production is due to start in early 2005. The joint venture will start by producing 256Mbit devices in BGA packages.
Wafers for further processing will come primarily from Infineon's collaborative projects with SMIC (Shanghai, China), Winbond and Nanya (both in Taiwan), but shipments from Dresden, Germany, and Richmond, USA, are also planned.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE
VIEW SESSIONS
