Intellectual Property
The Oxford team has developed a simple and efficient way of opening and
filling tubes. In addition, it found that metal salts could be incorporated
into the inner body of the tubes forming nanoparticles on reduction.
The filled nanotubes have very interesting magnetic properties and potential
for application in many fields. By analogy with shape-selective catalysts
such as zeolites, it is envisaged that open buckytubes containing catalyst
particles might display useful selectivity by virtue of substrate size
discrimination or by virtue of the exposure of only one or two of the
possible surfaces of a contained metal crystal.
This discovery has been a granted US patent (No.6090363). Isis Innovation is
interested in discussing suitable arrangements with companies that wish to
develop and use this technology.
Broadcom and Intel have settled all outstanding litigation between the
companies as well as all litigation involving their affiliates. The
companies and some of their subsidiaries have been engaged in several patent
lawsuits in the US federal courts as well as proceedings at the US
International Trade Commission. Under the settlement, all outstanding claims
and counterclaims in those actions will be dismissed with prejudice. The
various parties also entered into reciprocal releases covering all patent
and certain other claims. In connection with the settlement, Broadcom will
pay Intel $60mn in cash in two equal installments in FQ3 and FQ4 2003.
Additionally, Broadcom and Intel entered into a separate comprehensive
cross-license agreement covering patents owned or controlled by either party
or its subsidiaries, and having a first effective filing date, at any time
through to August 7, 2008. Under the agreement, products of each party and
its subsidiaries are licensed under the patents of the other for the
respective lives of the patents. Each party will be licensed to use all of
the existing products of the other. Certain proprietary products of each
party are not licensed to the other, but neither company believes that the
license exceptions are material to its business as currently conducted or
planned. No fees or royalties are payable by either party with respect to
its business as currently conducted or planned.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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