Info
Info
News Article

Gbit DDR Samples From 110nm Process

Infineon Technologies has shipped the first samples of its 1Gbit double data rate (DDR) Synchronous DRAM (SDRAM) to key customers. The devices are fabricated using the company's 110nm CMOS process resulting in a chip of area 160mm2 – claimed as the industry's smallest to date.
Infineon Technologies has shipped the first samples of its 1Gbit double data rate (DDR) Synchronous DRAM (SDRAM) to key customers. The devices are fabricated using the company's 110nm CMOS process resulting in a chip of area 160mm2 - claimed as the industry's smallest to date.


To achieve the highest memory density per module, Infineon will use a stacked version of the FBGA package to produce 4GByte registered modules. The "Dual Die Stack" technology puts two chips into a fine-pitch ball grid array package. Other package formats using the new chips will also be available and used in module production. All modules will start sampling in Q4 2003 and enter into volume production early 2004.


The ICs will initially be manufactured at Infineon's Dresden facility in Germany and will become generally available in Q4 2003.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
AP&S Expands Management At Beginning Of 2021
EV Group Establishes State-of-the-art Customer Training Facility
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
ITRI And DuPont Inaugurate Semiconductor Materials Lab
New Plant To Manufacture Graphene Electronics
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
DISCO's Completion Of New Building At Nagano Works Chino Plant
Panasonic Microelectronics Web Seminar
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
ASML Reports €14.0 Billion Net Sales
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Cadence Announces $5M Endowment To Advance Research
TEL Introduces Episode UL As The Next Generation Etch Platform
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Changes In The Management Board Of 3D-Micromac AG
Will Future Soldiers Be Made Of Semiconductor?
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Onto Innovation Announces New Inspection Platform
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
SUSS MicroTec Opens New Production Facility In Taiwan

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event