KLA-Tencor and Carl Zeiss Microelectronic Systems have established an alliance on next-generation photomasks for the 90nm and below technology nodes. The joint-development is aimed at providing the most comprehensive and cost-effective solution available to detect, review and disposition defects on advanced reticles. The companies plan to fully integrate reticle inspection, testing, metrology, review and defect dispositioning.

KLA-Tencor and Carl Zeiss Microelectronic Systems have established an alliance on next-generation photomasks for the 90nm and below technology nodes. The joint-development is aimed at providing the most comprehensive and cost-effective solution available to detect, review and disposition defects on advanced reticles. The companies plan to fully integrate reticle inspection, testing, metrology, review and defect dispositioning.

The aim is to tackle not only traditional defects that print upon first use but also the progressive defects that can arise throughout the reticle lifecycle. Resolution enhancement technologies (RETs) used to extend the life of 248nm and 193nm lithography tools create increasingly complex mask features that have a greater likelihood of printing yield-limiting defects during IC fabrication.

The work will involve enabling bi-directional information sharing between KLA-Tencor's TeraScan, TeraStar and STARlight reticle inspection systems, and Carl Zeiss SMT's AIMS fab and AIMS fab plus systems for both 248nm and 193nm wavelengths. This will allow reticle defect data and images captured by KLA-Tencor's inspection systems to be used by Carl Zeiss SMT's review and disposition tools. The results can then be fed back.

The interlink is intended to be retrofitable. Demonstrations of the new solution will begin in October 2003 in Germany and California.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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