Bookham Technology has completed execution of a major cost reduction initiative four months ahead of the original target. The initiative involved consolidation of its two main wafer fab facilities, following the acquisition of the Nortel Networks Optical Components businesses (NNOC).

Bookham Technology has completed execution of a major cost reduction initiative four months ahead of the original target. The initiative involved consolidation of its two main wafer fab facilities, following the acquisition of the Nortel Networks Optical Components businesses (NNOC).

Production previously carried out at the Ottawa wafer fab facility in Canada, acquired through the acquisition, has been consolidated into the company's Caswell facility in the UK. By completing this consolidation ahead of schedule, the company should start seeing the full impact of the closure in Q4 2003.

The closure of the Ottawa fab has impacted 200 employees, of which approximately 75% have now left the company. The remainder are expected to transition out as they gradually complete fab shut-down duties by the end of the year. The company will maintain an R&D and customer support presence of 70 employees in a separate nearby facility in Kanata, Canada.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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