Info
Info
News Article

Motorola's 4Mbit MRAM

Motorola reports that it has produced the world's first 4Mbit magnetoresistive random access memory (MRAM) chip. Select customers are currently evaluating samples.
Motorola reports that it has produced the world's first 4Mbit magnetoresistive random access memory (MRAM) chip. Select customers are currently evaluating samples.


The chip is based on a 0.18micron five-level metal CMOS process technology. Motorola demonstrated 1Mbit MRAM using 0.60-micron technology in June 2002.


Motorola believes that MRAM could replace multiple memory devices with reduced system complexity, lower overall system cost, and improved performance.


Dr Claudine Simson, chief technology officer, Motorola's Semiconductor Products Sector, comments: "We've made significant progress toward establishing a solid MRAM manufacturing technology capability. We're now working with lead customers on performance refinements for future market introduction and broader sampling next year."


MRAM could initially enter the market in applications that require speed, reliability and low power, says Motorola.


Motorola has obtained several patents covering multiple aspects of the bit cell structure, programming method and circuit design.


The three most fundamental challenges facing MRAM implementation are bit selectivity, data retention and scaling. Motorola says that these are addressed by its technology.


. Improved bit selectivity allows the writing of information anywhere in the memory without disturbing previously stored data. Exceptional data retention allows stable, long-term storage of information. Scaling to smaller geometries allows designers to pack more cells into a smaller area, resulting in lower cost.


The memory uses unidirectional programming currents with isolated write and read paths and balanced current mirror sense amplifier. Motorola is scheduled to present details of its "toggle" approach to MRAM at the IEEE International Electron Devices Meeting (IEDM), December 8-10, 2003.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Cadence Announces $5M Endowment To Advance Research
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
K-Space Offers A New Accessory For Their In Situ Metrology Tools
EV Group Establishes State-of-the-art Customer Training Facility
Onto Innovation Announces New Inspection Platform
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
AP&S Expands Management At Beginning Of 2021
TEL Introduces Episode UL As The Next Generation Etch Platform
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
New Plant To Manufacture Graphene Electronics
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
DISCO's Completion Of New Building At Nagano Works Chino Plant
Panasonic Microelectronics Web Seminar
Will Future Soldiers Be Made Of Semiconductor?
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
ITRI And DuPont Inaugurate Semiconductor Materials Lab
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Changes In The Management Board Of 3D-Micromac AG
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
ASML Reports €14.0 Billion Net Sales
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
SUSS MicroTec Opens New Production Facility In Taiwan

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event