"Microchip Technology's continuous improvement culture and systems have
resulted in competitive yields across all of our fabs, and short lead
times for our broad range of customers around the world,"

"Microchip Technology's continuous improvement culture and systems have
resulted in competitive yields across all of our fabs, and short lead
times for our broad range of customers around the world," said Dave
Lambert, vice president of Microchip's Fab Operations. "We are joining the
FOA's membership to exchange best-practice knowledge, as part of our
relentless drive to further optimise cycle times."

Terry Pope, Skyworks Solutions vice-president of semiconductor
manufacturing said, "I believe it is still possible to be competitive with
semiconductor manufacturing in the United States. To do this requires that
companies take advantage of every opportunity to reduce input costs,
maximize efficiency of fab tools, and minimize the cost to maintain top
factory performance."

"The addition of multiple new members like Microchip and Skyworks over the
past year has created a compelling gravity to the FOA as an organization,"
stated L.T. Guttadauro, FOA executive director. "By attracting new device
makers and suppliers, we can improve the value of our benchmarking data,
survey capabilities and collaborative purchasing power for all members."

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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