The market continues to witness a proliferation of automobile electronic content due to government pollution guidelines, safety and security regulations, and the ongoing oil crisis.

The market continues to witness a proliferation of automobile electronic content due to government pollution guidelines, safety and security regulations, and the ongoing oil crisis.This growing need directly influences the markets of automobile application specific integrated circuits (ASICs), application specific standard parts (ASSPs), and field programmable gate arrays (FPGAs).New analysis from Frost & Sullivan reveals that the market earned revenues of $6.75 billion in 2006 and estimates this to reach $10.26 billion in 2010."The automobile ASIC, ASSP, and FPGA markets have witnessed significant increases due to the growth of end-user markets and expanding applications of integrated circuits (ICs) in automobiles," notes Frost & Sullivan Senior Research Analyst Bonnie Varghese K. "Moreover, the increasing luxury features in automobiles require very efficient solutions thereby boosting market demand."In addition, rising fuel prices in the world market, feed the demand for electric and hybrid vehicles, which in turn can boost the growth of electronics in automobiles.Sales of ASICs, ASSPs, and FPGAs have also improved due to integrated solutions, which have enabled manufacturers to lower costs by reducing the number of microcontrollers in automobiles.Mandatory government regulations to enforce safety and security have greatly contributed to the growth of this market. In Europe, regulations such as the electronic stability program (ESP), antilock braking system(ABS), and electronically controlled independent suspension will likely help generate substantial revenues.In the Asian region, increasing sales of automobiles drives the growth of ASICs, ASSPs, and FPGAs markets. The Asian market also has the potential to become the key contributor to the overall automobile ASIC, ASSP, and FPGA revenues.Since safety, security, engine control features, telematics, and driver information applications will likely advance in the future, the automobile ASIC, ASSP, and FPGA markets appear poised for significant growth.However, there exists intense competition in the market, especially among well-established segments such as ASIC and ASSP. These products are characterised by higher non-recurring engineering (NRE) and take a longer time to market even though their unit and integration costs remain less than FPGAs.Technological developments can help reduce the time to market and NRE cost in ASIC and ASSP. Similarly, developments in FPGAs can lower the unit and integration costs and improve performance."ASIC and ASSP segment participants can benefit by targeting growing and developing economies, such as Asia, where opportunities exist in the low cost and higher volume automobile applications," suggests Varghese.Chipmakers can further resist competition by creating an extensive portfolio of core designs, developing world-class electronic design automation (EDA) software tools, and proactively engaging with original equipment manufacturer (OEM) customers in accelerating the market share of programmable logic devices (PLDs).

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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