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Friday 7th June 2019
Thursday 6th June 2019
MoS2 investigated on morphological and electrical aspects using Park NX-Hivac AFM (Park Systems). Jonathan Ludwig, Marco Mascaro, Umberto Celano, Wilfried Vandervorst, Kristof Paredis, IMEC, Leuven, Belgium, Department of Physics and Astronomy, University of Leuven, Leuven, Belgium
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Wednesday 5th June 2019
$21M building has three times the floor area and 3.5 times the processing space of the previous building
Friday 31st May 2019
Join Product Marketing Manager at Wolfspeed, Dave Skinner and Mark Andrews Technical Editor of Silicon Semiconductor to understand SiC Design Tips and Tricks
Thursday 30th May 2019
Picture credit: © Michele Simoncelli - Heat conduction in a thermoelectric illustration . Heat is the energy due to vibrations of atoms. The ridges represent the quantum vibrational energy levels of CsPbBr3, a promising thermoelectric material. Heat conduction originates from both diffusion of vibrational excitations (blurred spheres, following the energy level) and quantum tunnelling (jump between different energy levels, represented by blue waves).
Wednesday 29th May 2019
More stringent IPCC guidelines include accounting for CF4 by-product formation and emissions.
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Tuesday 28th May 2019
TriEye was founded in 2016 by Avi Bakal (CEO), Omer Kapach (VP R&D) and Prof. Uriel Levy (CTO), after nearly a decade of advanced nano-photonics research by Prof. Levy at the Hebrew University in Jerusalem.
Tuesday 21st May 2019
EVG ComBond® automated high-vacuum wafer bonding system
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Wednesday 15th May 2019
A pulse of ultrasound traveling through a solid is attenuated as it goes and is reflected and/or transmitted by material interfaces. An x-ray beam is also attenuated but ignores material interfaces. An ultrasonic pulse must be inserted at 90° to the surface, but x-ray can be inserted at almost any angle. The usefulness of these and other differences is described by Tom Adams, consultant, Nordson SONOSCAN
Monday 13th May 2019
EPC's chief executive, Alex Lidow, believes his GaN devices now beat silicon on performance and price, reports Rebecca Pool.

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