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The continually growing demand for faster mobile data access and smart integration strategies is creating new and greater requirements affecting RF filter designers and manufacturers. EV Group examines ways to accelerate the production of SAW-based devices through the use of new materials and packaging methods supported by advanced wafer bonding techniques. By Dr. Thomas Uhrmann, EV Group

Huawei Faces Storage Supply Struggles

Tuesday 18th June 2019

U.S. Ban Takes a Toll on Huawei and on its American Memory and Storage Suppliers IHS Markit Says Micron and Western Digital contend with immediate impacts—while Huawei faces longer-term storage-supply challenges

The Future Is Silicon

Thursday 13th June 2019

Renesas Electronics Develops New Flash Memory Technology

Wednesday 12th June 2019

EV GROUP Brings Nanoimprint Lithography To Full-scale Production

Tuesday 11th June 2019

SiFive Secures $65.4 Million In Series D Funding

Tuesday 11th June 2019

Infineon To Acquire Cypress

Friday 7th June 2019

TSI Introduces New AeroTrak-Plus Remote Airborne Particle Counters

Friday 7th June 2019

Advantages Of High Vacuum For Electrical Scanning Probe Microscopy

Thursday 6th June 2019

MoS2 investigated on morphological and electrical aspects using Park NX-Hivac AFM (Park Systems). Jonathan Ludwig, Marco Mascaro, Umberto Celano, Wilfried Vandervorst, Kristof Paredis, IMEC, Leuven, Belgium, Department of Physics and Astronomy, University of Leuven, Leuven, Belgium

Socionext Adopts The Cadence Tools For 7nm Designs

Wednesday 5th June 2019

Disco Completes New Silicon Valley Office

Wednesday 5th June 2019

$21M building has three times the floor area and 3.5 times the processing space of the previous building

Okmetic To Double SOI Wafer Production Capacity By Second-half 2020

Monday 3rd June 2019

Webinar: SiC Design Tips And Tricks

Friday 31st May 2019

Join Product Marketing Manager at Wolfspeed, Dave Skinner and Mark Andrews Technical Editor of Silicon Semiconductor to understand SiC Design Tips and Tricks

In Search Of Efficient Thermoelectrics

Thursday 30th May 2019

Picture credit: © Michele Simoncelli - Heat conduction in a thermoelectric illustration . Heat is the energy due to vibrations of atoms. The ridges represent the quantum vibrational energy levels of CsPbBr3, a promising thermoelectric material. Heat conduction originates from both diffusion of vibrational excitations (blurred spheres, following the energy level) and quantum tunnelling (jump between different energy levels, represented by blue waves).

Edwards Responds To UN Greenhouse Gas Guidelines

Wednesday 29th May 2019

More stringent IPCC guidelines include accounting for CF4 by-product formation and emissions.