Cadence Design Systems has announced
that its full suite of Cadence digital, signoff and custom/analog IC
design tools, along with advanced IC packaging design solutions, support
the new TSMC Wafer-on-Wafer (WoW) stacking technology.
newcomer Spin Transfer Technologies believes their approach to magnetoresistive
random access memory (MRAM) may reset computer memory paradigms through
dramatically improved retention paired with sizably smaller current