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Wednesday 21st March 2018
Coverage performance comparison on 4 different base materials (Isola IS410,Panasonic R1755C, Nanya NP140,Shengyi S1141) after new make-up, throughput and with maximum drag-in of Neoganth W Pre Dip into the subsequent activator bath
Wednesday 21st March 2018
KLA-Tencor to add $2.5 billion of addressable market opportunity in printed circuit board, flat panel display, packaging, and semiconductor manufacturing
Friday 9th March 2018
Imec has made considerable progress towards enabling extreme ultraviolet (EUV) lithography single exposure of N5 32 nm pitch metal-2 layers and of 36 nm pitch contact holes. Greg McIntyre, Peter De Bisschop, Danilo De Simone, Frederic Lazzarino and Victor Blanco from the imec patterning team explain some of the key steps and highlight the impact on the semiconductor industry. The results have been presented in multiple papers at the 2018 SPIE Advanced Lithography Conference.
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Wednesday 7th March 2018
Kaman Precision Products offers a new, non-contact proximity sensing solution for wide ranging power electronics applications. Its built-in switch output control provides easier set-up and calibration while also delivering speed and precision in a new compact form factor. By: Kevin Conlin, Kaman Precision Products
Thursday 1st March 2018
Extreme ultraviolet and 193 immersion lithography technology and Cadence digital tools used to design 3nm CPU core
Thursday 1st March 2018
Thursday 1st March 2018
Acquisition price represents a total equity value of about $8.35 billion
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Wednesday 28th February 2018
Growing nanocrystals of GaAs on tiny columns of silicon and germanium could lead to new types of sensors, LEDs, and solar cells
Tuesday 27th February 2018
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Tuesday 27th February 2018
TU Wien has developed a sensor for measuring the strength of electric fields, which is smaller, simpler and less prone to distortion than comparable devices.Picture: Tiny new sensor - compared to a one-cent-coin
Monday 26th February 2018
Image: EUV single patterning of (left) the N5 32nm metal-2 layer, (middle) 32nm pitch dense lines, and (right) 40nm hexagonal contact holes and pillars
Monday 26th February 2018
Qualcomm anticipates that its future Snapdragon 5G mobile chipsets will use Samsung’s 7nm LPP EUV process technology
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