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Tuesday 30th July 2013
Nanopatterning, or self-assembling molecular materials, form an organised lithographic pattern on semiconductor crystals, for use as integrated circuits. Now newly developed materials, when integrated into electronics, will enable the development of ultra-lightweight, compact and efficient devices
Tuesday 30th July 2013
Tuesday 30th July 2013
Tuesday 30th July 2013
Mobile phones, tablets, strong memory growth and higher average selling prices (ASPs) in DRAM and NAND will have a positive impact on the semiconductor market in 2013
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Thursday 25th July 2013
The ultra-slim mobile memory chips will enable thinner and more sophisticated top-of-the-range smartphones
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Thursday 25th July 2013
The tiny 2mm x 2mm precision orientation sensor combo enhances freedom to optimise system performance and create smaller form factors in products such as smartphones
Wednesday 24th July 2013
MEMS is still following vigorous growth, urging manufacturers to consider consumer applications in their strategies
Wednesday 24th July 2013
Leveraging on the success of its 300mm tool, the Ultratech laser spike annealing system will be used for 450mm manufacturing
Wednesday 24th July 2013
Using a new technology, very high-quality materials and devices, such as processing semiconductors over large areas, can be accomplished with an instrument slightly larger than a printer
Wednesday 24th July 2013
The new NSX metrology series includes application-specific configurations to address unique metrology requirements for wafer level packaging, 2.5D and 3DIC

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