+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

KLA-Tencor expands IC Packaging Portfolio

KLA-Tencor's new Kronos 1080 wafer inspection system and ICOS F160 die sorting and inspection system are designed to address a wide variety of IC packaging challenges.

KLA-Tencor has announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges. The Kronos 1080 system offers production-worthy, high sensitivity wafer inspection for advanced packaging, providing key information for process control and material disposition. The ICOS F160 system examines packages after wafers have been diced, delivering fast, accurate die sort based on detection of key defect types"”including sidewall cracks, a new defect type affecting the yield of high-end packages. The two new inspection systems join KLA-Tencor's portfolio of defect inspection, metrology and data analysis systems that help accelerate packaging yield and increase die sort accuracy.

KLA-Tencor's new Kronos 1080 wafer inspection system and ICOS F160 die sorting and inspection system are designed to address a wide variety of IC packaging challenges.

"As chip scaling has slowed, advances in chip packaging technology have become instrumental in driving device performance," said Oreste Donzella, Senior Vice President and Chief Marketing Officer at KLA-Tencor. "Packaged chips need to achieve simultaneous targets for device performance, power consumption, form factor and cost for a variety of device applications. As a result, packaging design has become more diverse and complex, featuring a range of 2D and 3D structures that are more densely packed and shrinking in size with every generation. At the same time, the value of the packaged chip has grown substantially, along with electronics manufacturers' expectations for quality and reliability. To meet these expectations, packaging manufacturers, whether in the back end of a chip manufacturing fab or in an outsourced assembly and test (OSAT) facility, have demanded more sensitive, cost-effective inspection, metrology and data analysis"”and more accurate identification of bad parts. Our engineering teams have developed the new Kronos 1080 and ICOS F160 systems to serve the electronics industry's growing needs for production-worthy defect detection for a wide variety of packaging types."

The Kronos 1080 system is designed to inspect advanced wafer-level packaging process steps, providing information on the full range of defect types for inline process control. Advanced packaging technology necessarily includes ever-smaller features, higher-density metal patterns, and multi-layer redistribution layers"”all of which have increasing inspection requirements that demand innovative solutions. The Kronos system achieves its industry-leading performance through multi-mode optics and sensors and advanced defect detection algorithms. The Kronos system also introduces FlexPoint, an advanced technology derived from KLA-Tencor's leading inspection solutions for IC chip manufacturing. FlexPoint focuses the inspection system on key areas within the die where defects would have highest impact. Flexible wafer handling enables the inspection of high-warp wafers, frequently encountered in a package type called fan-out wafer-level packaging"”an established type for mobile applications and an emerging technology for networking and high-performance computing.

After wafer-level packages are tested and diced, the ICOS F160 performs inspection and die sorting. Manufacturers of high-end packages, such as those used for mobile applications, will benefit from new capability to detect laser-groove, hairline and sidewall cracks. These cracks result from a change in the materials used to insulate the dense on-chip metal routing to facilitate increased speed and reduced power consumption. The new material is brittle, making it susceptible to cracks during wafer dicing. Sidewall cracks are notoriously difficult to detect, as they lie perpendicular to the top of the die and are not detectable using traditional visual inspection. Another major advantage of the ICOS F160 system, beneficial to many packaging types, is its flexibility: input and output modes can be wafer, tray or tape. The system is easily changed from one configuration to another. Its automatic calibrations and precision die pickup facilitate increased tool utilization in high volume manufacturing environments.

The Kronos 1080 and ICOS F160 systems are part of KLA-Tencor's portfolio of packaging solutions designed to address inspection, metrology, data analysis and die sorting needs for a variety of IC packaging types. This portfolio includes the CIRCL -AP all-surface wafer inspection system, Zeta-580/680 3D metrology system for wafers and panels, ICOS T890, T3 and T7 Series component inspection and metrology systems, and Klarity data analytics system. More information about the two new defect inspection systems and KLA-Tencor's full packaging solution portfolio can be found on the packaging portfolio web page.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: