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News Article

Panasonic Commercializes Granular EMC Semiconductor Encapsulation Materials for FOWLP and PLP


Panasonic Corporation announced that it has commercialized a granular semiconductor encapsulation material designed specifically for fan-out wafer-level package (FOWLP(*1)) and panel level packaging (PLP(*2)). Sample production is scheduled to start in September 2018. These new products will increase the productivity of these leading-edge semiconductor packages for wearable and mobile devices and reduce their manufacturing costs. .

Electronic designers and manufacturers are increasingly incorporating more functionality into smaller form-factor products. This trend has driven the development and adoption of semiconductor packaging technologies that deliver lower profile, reduced footprint packages using cost-effective and scalable processes. PLP offers the promise of significantly reduced costs because of the large number of semiconductors that can be packaged in each molded panel. Encapsulation materials of these semiconductor packages need to uniformly encapsulate large-area formats like wafers and panels without warpage while exhibiting excellent adhesion to the other structures within the package. The newly commercialized granular epoxy mold compounds meet these requirements. .

Panasonic has developed a portfolio of semiconductor encapsulation materials for FOWLP and PLP. In addition to the newly commercialized granular epoxy mold compounds, Panasonic also offers sheet-format encapsulants (suitable for encapsulation thicknesses of 200 μm or less), as well as liquid encapsulation products. .

Features of the granular semiconductor encapsulation material

By combining low warpage with high flow, this material improves the semiconductor package process productivity.

Excellent adhesion to the redistribution layer (RDL) (*3) is integral to enabling a variety of package designs.

Leading-edge semiconductor packages (FOWLP, PLP, FOSiP (*4), WLCSP (*5), etc.) for radio frequency (RF) and power management ICs used in wearable electronics, mobile devices and other high functionality electronic devices. Series X851C is designed for chip-first packages and X851D is designed for chip-last package. .

These new products will be on display in the Panasonic Electronic Materials booth at SEMICON Taiwan 2018, which will be held at the Taipei Nangong Exhibition Center from September 5 to 7, 2018.

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