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Saturday 2nd March 2013
Using novel design and fabrication techniques, MEMS technology can be used to create a camcorder in the human body
Friday 1st March 2013
IBM held onto the number 1 spot in the worldwide server systems market  for Q412, as revenue increased 3.1% year over year, much of it thanks to escalating demand for its System z mainframes
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Thursday 28th February 2013
The firm's new metrology and inspection tools facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips
Thursday 28th February 2013
Proprietary APiC technology, which enables the characterisation of each layer, will be further extended for use in the microelectronics industry and thin-materials analysis
Thursday 28th February 2013
The low capacitance product supports high-currents and improves the efficiency of high-speed switching
Wednesday 27th February 2013
With a spectacular 60 percent growth in 2012, Apple and Samsung were the top consumers of MEMS microphones last year. They accounted for a combined 54 percent of all MEMS microphones shipped
Wednesday 27th February 2013
While Qualcomm increased its lead at the top from 2007 to 2012, Texas Instruments plummeted from second to sixth place
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Wednesday 27th February 2013
The firm will exhibit its digital solutions for flow, vacuum and pressure measurement with partner SCH Electronics at booth #5505
Tuesday 26th February 2013
The company is now churning out some 4 million MEMS devices a day
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Monday 25th February 2013
The two organisations are collaborating to advance ASIP design, reducing the cost, performance and power consumption of mobile systems-on-chip
Friday 22nd February 2013
Promoted from director of memory cell engineering, Ken Mackay will take charge of leading the integration of Crocus’ magnetically enhanced semiconductor technology to final product quality stage
Friday 22nd February 2013
The manufacturer of plasma etch, strip and deposition systems for critical surfaces in the semiconductor and related industries has signed an agreement with S3 Alliance. S3 will work with R&D, MEMS and production fabs
Friday 22nd February 2013
The new WTR1625L and RF front end chips harness radio frequency band proliferation, enabling OEMs to develop thinner, more power-efficient devices with global 4G LTE mobility

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