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Tuesday 25th June 2013
The acquisition strengthens SPTS' MEMS vapour release etch IP and product portfolio
Tuesday 25th June 2013
According to microtechnology experts, China is currently very dependent on imports from Europe. And so in the short term, trading relations should be OK
Friday 21st June 2013
The 10MB ARM Cortex-A9 enables low-power, low-cost embedded display applications up to WXGA (1280x768) resolution. Renesas says the device removes the need for external DRAM memory
Friday 21st June 2013
DRAM and logic customers are pursuing DSA due to the high cost and delayed introduction of EUV lithography equipment, and costly multiple patterning techniques
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Friday 21st June 2013
 The room temperature tunnelling behaviour of boron nitride (BN) nanotubes has been demonstrated with the aid of gold quantum dots
Friday 21st June 2013
Although the outlook for semiconductor equipment market is improving, it will remain soft in the short term
Friday 21st June 2013
Both companies believe Microsemi customers will benefit from strong, worldwide technical support
Thursday 20th June 2013
The firm's LSA201 system has been shipped to a major IDM for advanced logic node development
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Thursday 20th June 2013
The compact Pemtron SEM systems have been designed to bridge the gap between tabletop and full size tungsten SEMs
Thursday 20th June 2013
Composed of many silicon related compounds, this device is suited to automotive applications
Wednesday 19th June 2013
The firm says its CMOS technology for custom imaging products and expertise in bringing specialty processing and MEMS to volume manufacturing fits extremely well with the proven capabilities of its customers
Wednesday 19th June 2013
The specialist in silicon IP has ordered design automation tool Analog FastSPICE
Wednesday 19th June 2013
In large-area exposure mode, the system can be used for surface annealing applications of semiconductors
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Wednesday 19th June 2013
The demand for new MEMS sensors will lead to a $6.4 billion market by 2018
Wednesday 19th June 2013
Tuesday 18th June 2013
The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV
Tuesday 18th June 2013

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