Info
Info
News search:

< Page of 405 >

News


Wednesday 2nd May 2012
The R & D institute is inviting firms to join its 60GHz R&D program as a research partner. Otherwise, they can have access to the technology for further development through licensing
Wednesday 2nd May 2012
A combination of performance improvement and power reduction will enable new innovations across a range of future 22nm-based devices from the smallest handhelds to powerful cloud-based servers
Info
Monday 30th April 2012
The development of MEMS and other ultra advanced CMOS technologies on 300mm and 450mm wafers will be vital to enable Europe to provide superior products on a global scale
Friday 27th April 2012
The company is installing TSV production processing tools to its newest facility, Fab 8 to enable the stacking of multiple chips on top of each other. The firm is also collaborating with its partners to develop packaging solutions that will enable the next wave of innovation in the industry
Friday 27th April 2012
The two firms together captured 55 percent of global smartphone shipments in Q1 2012
Friday 27th April 2012
Nokia was consistently the world’s largest handset vendor for 14 years up to 2011, but has now finally yielded its number one position to Samsung in the last quarter
Thursday 26th April 2012
New variations on MEMS technology, focusing on light manipulation, are now surfacing in the market and improving growth
Info
Thursday 26th April 2012
In 2012, the forecast for semiconductor revenue has been upgraded by 1 percent to 4.3 percent due to solid demand for wireless products such as cellphones and media tablets
Thursday 26th April 2012
Chinese firms, Huawei, ZTE And TCL join Apple, Samsung and Nokia in the top 10
Wednesday 25th April 2012
The firm's large pad pitch "Diamond" package is claimed to solve critical space issues in the design of mobile devices
Wednesday 25th April 2012
Broadcom's fully programmable NPUs incorporate 64 custom processors running at 1GHz . They are claimed to deliver more than double the throughput of any other NPU on the market
Wednesday 25th April 2012
In 2011, TEL, Hitachi and Ulvac were some of the companies who increased their market share in Plasma Etch, PVD and RTP/Diffusion, although ASML remained the key player in Lithography
Info
Wednesday 25th April 2012
The R & D institute has developed extending advanced memory and logic processes for high mobility channel CMOS devices, FinFETs, RRAMs and more
Wednesday 25th April 2012
Major assets from Cray will help accelerate Intel’s drive to achieve ExaFLOPS performance
Tuesday 24th April 2012
Using a modulation-doping strategy in 3D bulk SiGe thermoelectric materials enhances their carrier mobility and hence electrical conductivity by over 50%
Tuesday 24th April 2012
Can Novellus Reinvigorate Lam Research Asks The Information Network
Tuesday 24th April 2012
2011 Top 10 suppliers of critical subsystems to the semiconductor and related manufacturing industries
Tuesday 24th April 2012
Company forced to respond to ill informed stories

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info