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Tuesday 10th April 2018
Innodys to take on sales, marketing and technical support activities in France, Switzerland, Germany, the Benelux and UK
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Tuesday 27th March 2018
Shown above is the UnitySC 4See inspection tool.
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Monday 26th March 2018
From left: Jayne Brady, partner, Kernel Capital; Dr Bob Pollard, CEO, Causeway Sensors; William McCulla, director of corporate finance, Invest NI; and Odhran McNeilly, business adviser, Bank of Ireland UK. Image: Kernel Capital
Monday 26th March 2018
A miniaturized sensor mounted on a tooth. Photo: SilkLab, Tufts University
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Friday 23rd March 2018
EV Group's laser debonding modules incorporate a solid-state laser and proprietary beam-shaping optics designed to enable optimized, force-free debonding. The modules are designed for integration in the company's benchmark EVG®850DB automated debonding system.
Wednesday 21st March 2018
Coverage performance comparison on 4 different base materials (Isola IS410,Panasonic R1755C, Nanya NP140,Shengyi S1141) after new make-up, throughput and with maximum drag-in of Neoganth W Pre Dip into the subsequent activator bath
Wednesday 21st March 2018
KLA-Tencor to add $2.5 billion of addressable market opportunity in printed circuit board, flat panel display, packaging, and semiconductor manufacturing
Friday 9th March 2018
Imec has made considerable progress towards enabling extreme ultraviolet (EUV) lithography single exposure of N5 32 nm pitch metal-2 layers and of 36 nm pitch contact holes. Greg McIntyre, Peter De Bisschop, Danilo De Simone, Frederic Lazzarino and Victor Blanco from the imec patterning team explain some of the key steps and highlight the impact on the semiconductor industry. The results have been presented in multiple papers at the 2018 SPIE Advanced Lithography Conference.

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