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Thursday 7th December 2006
Integrand Software, Inc., an EDA software company and UMC global foundry announced their ongoing collaboration has resulted in new advances and enhanced capabilities for RF/mixed mode IC designers designing into 90nm and 0.13µm nodes.
Thursday 7th December 2006
Elpida Memory, Inc. and Powerchip Semiconductor Corp.(PSC) jointly announced that both parties will establish a new joint venture company to operate DRAM fabrication facilities in Central Taiwan Science Park with a total planned capacity of 240,000 12" wafers per month.
Thursday 7th December 2006
Entegris Inc. has reached an important industry milestone. The company recently surpassed its 300th Aeronex Gas Purification System installation.;;
Thursday 7th December 2006
Littelfuse, Inc. announced plans to transfer its semiconductor wafer manufacturing from Irving, Texas to Wuxi, China in a phased transition over the next three to four years.
Wednesday 6th December 2006
QinetiQ and Crown Holdings, Inc. have launched a joint development programme to adapt QinetiQ's Omni-ID Pak integrated Radio Frequency Identification (RFID) technology for use on metal packaging.
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Wednesday 6th December 2006
A $1 million grant from the Fred A. Lennon Charitable Trust means a new name and a lot more resources for a nationally renowned materials characterization facility at the Case School of Engineering.
Wednesday 6th December 2006
TranSwitch Corporation, announced that it has entered into a definitive agreement to acquire substantially all of the assets of the ASIC Design Centre division of Data JCE, Ltd., Israeli electronic components distribution company.
Wednesday 6th December 2006
The Institute for Microelectronics Stuttgart (IMS CHIPS) has developed what they claim to be as, the worlds thinnest silicon chips in cooperation with the University of Stuttgart
Wednesday 6th December 2006
Pac Tech has begun working on its new 53,512 square foot wafer bumping facility in Penang, Malaysia.
Wednesday 6th December 2006
New research of UK engineering academics and students reflects the growing European concern of a skills crisis growing for locally trained engineers across Europe.
Wednesday 6th December 2006
M+W Zander FE has been commissioned by the Conergy Group to plan and construct a fully integrated production facility for photovoltaic cells and modules in Frankfurt (Oder), Germany.
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Tuesday 5th December 2006
BOC Edwards announced that it has opened a new European semiconductor headquarters in Grenoble, France.
Tuesday 5th December 2006
Austriamicrosystems has unveiled an extensive prototyping schedule for High-Voltage CMOS, High-Voltage CMOS embedded Flash, SiGe-BiCMOS and CMOS specialty processes.
Tuesday 5th December 2006
Platinum Equity and ESCO Corporation announced that Platinum has acquired ESCO's Integrated Manufacturing Group (IMG)
Tuesday 5th December 2006
After years of coming close to breaking into the top-10 global semiconductor rankings, Advanced Micro Devices Inc. (AMD) and Hynix Semiconductor Inc. finally hit the big time in 2006, according to a preliminary ranking from iSuppli Corp.
Tuesday 5th December 2006
Functional integration in the portable media player and multimedia processor system-on-chip (SoC) markets will fundamentally change the value proposition for today’s integrated circuit (IC) vendors, according to Gartner, Inc. Research of System-on-Chip (SoC) Market
Tuesday 5th December 2006
Launching its next generation of energy-efficient computing, AMD announced transition to 65nm process technology with its Athlon 64 X2 dual-core desktop processors.
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Tuesday 5th December 2006
Tokyo Electron Limited (TEL)and ASML Holding NV announced plans to jointly evaluate their most advanced tools and engage in long-term joint development programs.
Tuesday 5th December 2006
STMicroelectronics announced full availability of its entire NAND Flash memory family in 70nm process technology.
Tuesday 5th December 2006
India’s Integrated Circuit (IC) design industry is booming, with market revenue expected to reach $2.1 billion by 2010, rising at a Compound Annual Growth Rate (CAGR) of 29 percent, up from $596 million in 2005, iSuppli Corp. predicts.
Monday 4th December 2006
United Test and Assembly Centre Ltd announced that its Thailand subsidiary, UTAC Thai Limited ("UTL") has leased another building to immediately expand the scope and scale of its operations in Bangkok, Thailand.
Monday 4th December 2006
Cadence Design Systems, Inc. and Silicon Integration Initiative (Si2) announced that Cadence has contributed the Common Power Format (CPF) to Si2's Low Power Coalition (LPC).
Monday 4th December 2006
VESTA Technology, Inc. has announced the shipment of a follow-on order of its next-generation single wafer ALD/CVD Metal System, VULCANTM to a major Japanese semiconductor company which will be used for < 45nm and next generation logic devices, as part of a joint development with their alliance companies in Japan.

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