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Thursday 30th November 2006
A collaboration agreement has been signed between ENDESA and ISOFOTÓN a Spanish Manufacturer of Solar Panels.
Thursday 30th November 2006
Mentor Graphics Corporation announced that it is enabling Silicon Valley Technical Institute (SVTI) to develop and offer a broad range of continuing education courses based on Mentor's tools in the areas of design for manufacturability (DFM), nanometer IC design, physical verification and integrated systems design.
Tuesday 28th November 2006
Hyphenated Systems announced the release of its new NanoScale Optical Profiler.
Tuesday 28th November 2006
Alliacense announced that Agilent Technologies has purchased from The TPL Group a license to use the Moore Microprocessor Patent (MMP) Portfolio.
Tuesday 28th November 2006
Celoxica announced cooperation with EBV Elektronik to provide electronic system level (ESL) design solutions to end customers using Altera's system-on-programmable-chip (SOPC) technology.
Tuesday 28th November 2006
SigmaTel, Inc has commented on a press release issued by Actions Semiconductor concerning Actions' latest attempt to invalidate two SigmaTel patents.
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Tuesday 28th November 2006
The SEZ Group has introduced its Esanti platform targeting front-end-of-line (FEOL) cleaning and resist-stripping processes. SEZ has become the market leader in the back-end-of-line (BEOL) single wafer wet processing by being the first in the arena and maintaining a technology lead.
Monday 27th November 2006
The CEO Members of the EU ICT Task Force presented their final Report entitled ;"Fostering the Competitiveness of Europe's ICT Industry" to Commission Vice-President Günter Verheugen (Enterprise & Industry) and to Commissioner Viviane Reding (Information Society & Media).
Friday 24th November 2006
Agilent Technologies Inc. launched a new product demonstration centre at its Santa Clara, Calif., corporate headquarters, showcasing its life sciences and chemical analysis capabilities.
Thursday 23rd November 2006
JMAR Technologies, Inc. announced that it has received a hearing date of December 14, 2006 to appeal the previously announced Nasdaq Stock Market ("Nasdaq") delisting notice.
Wednesday 22nd November 2006
picoChip has announced expansion in its global presence, with the establishment of a new development centre in Beijing, China.
Wednesday 22nd November 2006
LSI Logic Corporation announced it has acquired Metta Technology, Inc. for approximately $7 million in cash.
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Wednesday 22nd November 2006
Nova Measuring Instruments, Ltd. announced a cost reduction initiative including a headcount reduction of approximately 8% from its global organization.
Wednesday 22nd November 2006
SEMI has reported that worldwide semiconductor manufacturing equipment billings reached $10.97 billion in the third quarter of 2006.
Tuesday 21st November 2006
Applied Ventures, LLC has announced that it has invested $3.0 million in Solaicx, a private manufacturer of single-crystal silicon wafers for the solar photovoltaic (PV) industry.
Tuesday 21st November 2006
Applied Ventures, LLC has announced that it has invested $3.0 million in Solaicx, a private manufacturer of single-crystal silicon wafers for the solar photovoltaic (PV) industry.
Tuesday 21st November 2006
FEI Company announced that it has completed the sale of its Knights Technology subsidiary to Magma Design Automation Inc.
Tuesday 21st November 2006
FormFactor, Inc. announced the filing of a patent infringement lawsuit against Micronics Japan Co., Ltd., MJC, a Japanese corporation.
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Tuesday 21st November 2006
Eyelit, Inc., manufacturing software provider of operations for the electronics, MEMS and semiconductor industries announced that Touchdown Technologies, developer and manufacturer of advanced MEMS probecards, has purchased Eyelit’s Enterprise Manufacturing Execution suite to manage and control its production operations.
Tuesday 21st November 2006
Honeywell Specialty Materials announced that it will expand its Shanghai-based Asia Technology Centre to boost its research and development capability and meet increasing customer needs in Asian markets, particularly China.
Tuesday 21st November 2006
SUSS MicroTec has announced that the University of Alberta’s NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.
Tuesday 21st November 2006
As the semiconductor industry nears five years of continuous growth, an American analyst claims there is an indication that overheating may become a threat.
Tuesday 21st November 2006
UMC, global semiconductor foundry announced that it has successfully produced functional 45-nanometer (nm) SRAM chips that feature an impressive bit cell size of less than 0.25um2.
Monday 20th November 2006
NXP Semiconductors, formerly Philips Semiconductors, and Sony Corporation have signed a memorandum of understanding (MOU) to establish by mid-year 2007 a joint venture (JV) that will drive global adoption of contactless smart card applications in mobile phones.

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