Silicon Valley Solar announced that they have finalized an agreement with GSS (Gebäude-Solarsysteme) to produce Sol-XTM Flat-Plate Concentrator Modules at their Fully Certified Facility in Eastern Germany.
Oki Electric Industry Co., Ltd. and ZyCube Co., Ltd. have announced an agreement to cooperate in commercializing ZyCSP, an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP).
Sun Microsystems, Inc. and Intel Corporation have announced a broad strategic alliance centred on Intel's endorsement of the Solaris* Operating System (OS) and Sun's commitment to deliver a comprehensive family of enterprise and telecommunications servers and workstations based on Intel Xeon processors.
Blaze DFM has been chosen by the Semiconductor Technology Academic Research Centre (STARC) to provide leakage power optimization software that will be integrated into the STARCAD-CEL (Certified Engineering Linkage, one step ahead of DFM) reference design methodology.
Veeco Instruments Inc. has announced that the European Patent Office in Munich, Germany has ruled in its favour and has dismissed the opposition filed by Asylum Research Inc. against Veeco's European Patent No. 839,312 (the '312 patent).
Berkeley Design Automation Inc has announced it has established a wholly-owned subsidiary, Berkeley Design Automation KK (BDA KK), in Japan. BDA KK will provide direct sales and technical support to better serve the company's rapidly expanding Japanese customer base.
Hoku Materials, a division of Hoku Scientific, Inc. has announced the signing of a definitive contract with Sanyo Electric Company, Ltd., for the sale and delivery of polysilicon to SANYO over a seven-year period beginning in January 2009.
The Open NAND Flash Interface (ONFI) Working Group, an organization dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) devices, computing platforms and industrial systems, has announced the availability of the ONFI 1.0 specification. The chip-level standard interface simplifies Flash controller design, which facilitates the integration of a wide range of NAND Flash components into diverse end-use applications.
SoftJin and Cswitch Corporation announced the companies are setting up of an Off-Shore Development Centre (ODC) in India to focus on developing customized EDA tools for customers and for in-house use of Cswitch.
Cabot Microelectronics Corporation announced that it filed a legal action against DuPont Air Products NanoMaterials LLC (DA Nano) for DA Nano's manufacture and marketing of certain CMP slurries that infringe patents owned by Cabot Microelectronics.
According to data in IC Insights¹ 2007 edition of The McClean Report, A Complete Analysis and Forecast of the Integrated Circuit Industry, fabless IC suppliers secured 20% of worldwide IC sales in 2006, an increase from just under 10% of the total IC market in 2000.
The SEZ Group has reported another record year of sales and order figures for the business year 2006. Order intake increased by 39.3 percent to 407.7 million Swiss Francs (CHF) and surpassed CHF 400 million for the first time.
NXP Semiconductor, founded by Philips, and Taiwan Semiconductor Manufacturing Company Limited (TSMC) have announced they will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as manufacturing partnership.
HP has unveiled research that could lead to the creation of field programmable gate arrays (FPGAs) up to eight times denser – while using less energy for a given computation – than those currently produced.