The SEZ Group has announced that a major Korean semiconductor manufacturer has placed a multiple-system order for SEZ's Da Vinci family of tools after successful beta test results revealed increased productivity, performance and cost-savings advantages.
NXP Semiconductors, formerly Philips Semiconductors, and Advanced Semiconductor Engineering, Inc. have announced the signing of a Memorandum of Understanding to form a joint venture (JV) in Suzhou, China focused on semiconductor testing and packaging.
Hynix Semiconductor Inc. created a stir in the DRAM market with a remarkable increase in shipments causing it to rise to the second rank for both the fourth quarter and for all of 2006, up from third previously, according to a preliminary ranking from iSuppli Corp.
Magma Design Automation Inc. announced that a U.S. District Court ruled Synopsys Inc. and IBM jointly own two of the three patents at issue in the California patent litigation between Magma and Synopsys, a decision consistent with the position Magma argued regarding the two patents. The court ruled that the third patent is owned solely by Synopsys.
NEC Corporation, NEC Viewtechnology, Ltd. and NEC Display Solutions, Ltd have agreed to merge the projector business of NEC Viewtechnology and the desktop and large-screen LCD businesses of NEC Display Solutions effective April 1, 2007.
The semiconductor lithography market reached $6.7 billion in 2006, finally eclipsing the $6.0 billion market reached back in 2000, according to the report "Sub-100nm Lithography: Market Analysis and Strategic Issues," recently published by The Information Network
SEMATECH and Tokyo Electron Limited (TEL) have launched a multi-year joint development program aimed at improving the prospects for using 3D interconnect technology and high mobility channel materials in advanced semiconductor manufacturing.
Texas Instruments (TI) has reported recorded record revenues and increased profits but express fears of weaker demand leading to a reduction of 500 staff by closing an older fab in their home Dallas base with a suggestion that development will move to Asia to be closer to foundry partners.
Silicon Valley Solar announced that they have finalized an agreement with GSS (Gebäude-Solarsysteme) to produce Sol-XTM Flat-Plate Concentrator Modules at their Fully Certified Facility in Eastern Germany.
Oki Electric Industry Co., Ltd. and ZyCube Co., Ltd. have announced an agreement to cooperate in commercializing ZyCSP, an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP).