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Wednesday 1st November 2006
PMC-Sierra, Inc. announced that its end-to-end 4Gbit/s Fibre Channel chipset, comprised of Tachyon Fibre Channel controllers and Cut-Through Switches, surpassed the four million ports shipped milestone.
Wednesday 1st November 2006
After two quarters of ballooning semiconductor inventories in the electronics supply chain, early results for the third quarter indicate that excess chip stockpiles are not going away.
Wednesday 1st November 2006
European semiconductor sales showed a positive development in August over July. Shipments of Microprocessors, under the spotlight in the previous months, reported a good result, in Europe as well as across other Regions.
Wednesday 1st November 2006
Zarlink Semiconductor announced the release of a sub-micron BiCMOS process technology specifically addressing increasing customer demand for control and intelligence in power management chips.
Monday 30th October 2006
Chartered Semiconductor Manufacturing announced it is making a strategic investment in Gateway Silicon Inc. (GSI), a Taiwan-based firm specializing in ASIC/System-on-Chip (SoC) design services and intellectual property (IP) development and integration. GSI is a spin-off of Taiwanese integrated device manufacturer (IDM) Macronix International Co., Ltd.
Monday 30th October 2006
AML's customers can now Activate, Align and Bond in-situ, in one chamber, with new AML ‘Radical' activation technology.
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Monday 30th October 2006
At the BroadGroup Power and Cooling Summit, IBM researchers presented an innovative approach for improving the cooling of computer chips, an increasingly urgent need given the large amount of heat released by today's more powerful processors and the additional energy required for removing that heat.
Monday 30th October 2006
Calypto Design Systems, Inc announced it is increasing local sales, support and research and development (R&D) teams in NOIDA, India.
Monday 30th October 2006
BOC Edwards and Aviza Technology, Inc. announced that they have entered into a Joint Development Agreement (JDA) to develop Atomic Layer Deposition (ALD) technology for advanced semiconductor manufacturing.
Monday 30th October 2006
Primarion, a mixed-signal semiconductor company announced its support for the Centre of Power Electronics Systems (CPES) and Colorado Power Electronics Centre (CoPEC).
Monday 30th October 2006
MEMC Electronic Materials, Inc announced that MEMC and Gintech Energy Corporation of Taiwan have executed a definitive agreement for MEMC to supply solar grade silicon wafers to Gintech.
Friday 27th October 2006
Soitec (SOI) announced that they have entered into a joint-development agreement with ARM to support the future development of silicon-on-insulator (SOI) libraries for the fabless/foundry arenas.
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Friday 27th October 2006
German EDA company MunEDA and Korean EDA-Distributor Davan Tech announced that Davan Tech Corporation will exclusively distribute and support MunEDA tools and solutions to the prospering Korean semiconductor and circuit design market.
Friday 27th October 2006
Outstanding performances in Europe's information and communication technologies industry were recognised at Frost & Sullivan's Excellence in Information & Communication Technologies (ICT) Awards Banquet held last Tuesday evening at the Le Meridien hotel in London.
Thursday 26th October 2006
Rudolph Technologies and Tokyo Electron Limited announced an agreement between the two companies that will provide Tokyo Electron (TEL) worldwide distribution rights for Rudolph's integrated lithography inspection technologies, to be included within TEL's coater/developer.
Thursday 26th October 2006
Amtech Systems, Inc. announced the Company has received over $10 million of solar orders since September 1, 2005, including a recent order totaling approximately $1.6 million from the solar cell industry for thermal processing systems.
Wednesday 25th October 2006
Mirabilis Design Inc. announced that Applied Micro Circuit Corporation ("AMCC") has adopted VisualSim for early architecture exploration of Processor-based SoC's for networking, storage and security.
Wednesday 25th October 2006
Virtus Advanced Sensors, developer of MEMS multi-axis inertial sensors has announced plans to commercialize next-generation sensor technology based on its extensive global patent portfolio.
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Wednesday 25th October 2006
Verigy Ltd. and Test Insight, announced an enhanced and integrated ability to read and write test programs used with the Verigy V93000 SOC tester.
Wednesday 25th October 2006
Solid State Equipment Corporation announces that its SSEC 3300 family of single wafer wet cleaners and processors has been certified through a third party for safety compliance with SEMI S2-0703aE.
Wednesday 25th October 2006
Ciranova, Inc., an EDA start-up specializing in integrated circuit design, announced that it has closed a third round of financing, raising a total of $4 million.
Wednesday 25th October 2006
Tegal Corporation announced that it has signed a distributor agreement with Noah Corporation of Japan.
Wednesday 25th October 2006
SUSS MicroTec announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc. Singapore.
Wednesday 25th October 2006
Microsemi Corporation announced that it has entered into a definitive agreement to acquire PowerDsine Ltd.

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