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Tuesday 24th October 2006
FPT Corporation, information and communications technology (ICT) provider in Vietnam, announced it issued new shares to private equity firm Texas Pacific Group (TPG) and Intel Capital, the venture capital organization of Intel Corporation.
Tuesday 24th October 2006
MOSIS has reached an agreement with Tanner EDA to provide foundry design kits free of charge to its customers.
Tuesday 24th October 2006
Infineon Technologies announced that the company expects charges of around Euro 80 million in the 2006 financial year due to the insolvency of its mobile phone customer BenQ Mobile GmbH & Co OHG.
Monday 23rd October 2006
SEMI's Cluster tool standards for semiconductor vacuum operations are still being ignored in the industry, according to the report Cluster Tools in IC Processing: Technology and Market Forecasts, recently published by The Information Network
Monday 23rd October 2006
Synplicity, Inc. announced it has joined the ARM Connected Community. As part of the ARM Connected Community, Synplicity will gain access to a full range of resources to help it market and deploy innovative solutions that enable developers to get their ARM Powered products to market faster.
Monday 23rd October 2006
A number of breakthrough applications for employing contact mask aligners have demonstrated the equipment's versatility far beyond the production of silicon wafers. Once reserved solely for the building of integrated circuits, contact mask aligners are now used to fabricate cutting edge products, including those that incorporate MEMS (miniature electro-mechanical systems) and microfluidics technology.
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Monday 23rd October 2006
ILS Technology announced that its third ServiceNET network hub began operations in Hong Kong.
Monday 23rd October 2006
Driven by the conversion to copper interconnect materials in the Memory Sector, demand for Copper Slurry for CMP will increase 26% in 2007, according to the report CMP Technology: Competition, Products, Markets, recently published by The Information Network
Monday 23rd October 2006
EV Group announced the installation of an EVG540C2W System at Datacon. During the long-term cooperation and development agreement in the field of advanced-chip-to-wafer (AC2W) technology, Datacon extends their Application Lab with EVG equipment.
Friday 20th October 2006
Samsung Electronics Co., Ltd announced that it has developed, what it claims to be as the industry's first 50-nanometer (nm) DDR2 DRAM (dynamic random access memory) chip, which will increase production efficiency from the 60nm level by 55 percent.
Friday 20th October 2006
Aviza Technology, Inc. has announced that the company was awarded a multi year grant of approximately 1.2 million (GBP), or $2.2 million (USD), from the Welsh Assembly Government's Regional Selective Assistance (RSA) program.
Wednesday 18th October 2006
Executives of Samsung Electronics and Hynix Semiconductor Inc. have been indicted in the USA into price-fixing in the computer memory chip business
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Wednesday 18th October 2006
Fujitsu Limited and Advantest Corporation today announced plans to establish a joint venture to create prototype semiconductors by using electron beam direct lithography.
Tuesday 17th October 2006
Ixia, global provider of IP performance test systems, has announced the establishment of a new EMEA headquarters to support its rapidly growing customer base in the region.
Tuesday 17th October 2006
ASML Holding NV (ASML) and partners in the semiconductor lithography supply chain have provided an update on their progress towards the commercialization of extreme ultraviolet (EUV) lithography.
Tuesday 17th October 2006
Amkor Technology, Inc. (AMKR) announced that it has commenced operations at its new 300mm wafer bump factory in Singapore using wafer bump processes currently offered by Amkor in Taiwan.
Monday 16th October 2006
Mitsubishi Electric Corporation (President and CEO: Setsuhiro Shimomura) announced that Mitsubishi Electric & Electronics U.S.A. Inc. (MEUS), a subsidiary of Mitsubishi Electric Corporation, has received a subpoena from the United States Department of Justice (DOJ) Antitrust Division seeking information about the sales of Mitsubishi Electric static random access memory (SRAM) in the United States.
Monday 16th October 2006
Agilent Technologies Inc. and AT4 Wireless (formerly known as CETECOM Spain) announced that Agilent's Measurement Systems Division and Wireless Business Unit have won a contract valued at more than US$1 million jointly with AT4 Wireless for fixed and mobile WiMAX conformance test and regulatory test systems with Telecom Technology Centre (TTC) Taiwan.
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Monday 16th October 2006
AMI Semiconductor and FLIR Systems announced an agreement for high volume manufacturing of uncooled microbolometer infrared detectors.
Monday 16th October 2006
Carl Zeiss SMT has announced the opening of an advanced development and production centre for lithography optics in Oberkochen.
Monday 16th October 2006
Advanced Micro Devices, Inc. (AMD) and ATI Technologies Inc. announced that the proposed acquisition of ATI by AMD has been approved by the Minister of Industry under the Investment Canada Act, satisfying one of the conditions to the closing of the acquisition.
Thursday 12th October 2006
With no signs of a major drop-off in semiconductor demand this year, iSuppli Corp. is reaffirming its forecast for global chip sales in 2006, issuing only a slight reduction in the outlook.
Wednesday 11th October 2006
In both the second and third quarter of 2006 Osram Opto Semiconductors placed additional follow-on orders for SUSS LithoFab200 Clusters, which are specifically used in volume production for the manufacturing of High Brightness / High Power Light Emitting Diodes (LED).
Wednesday 11th October 2006
IMEC, and TSMC announced the extension of IMEC's Europractice service with the offering of TSMC's technologies.

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