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Tuesday 13th February 2007
Sharp Corp. in the fourth quarter of 2006 was toppled from the top spot in the global LCD-TV market, falling to fourth place, down from first in the third quarter, according to a new market share ranking from iSuppli Corp.
Monday 12th February 2007
Intel Corporation researchers have developed a programmable processor that delivers supercomputer-like performance from a single, 80-core chip not much larger than the size of a finger nail while using less electricity than most of today's home appliances.
Monday 12th February 2007
Discretix announced that it plans to leverage its recent $20 million in new investment financing to pursue an expanded range of content protection solutions for the consumer and enterprise markets.
Monday 12th February 2007
HÜTTINGER has acquired a majority share of the Polish company AC Sp. z o.o.,
Monday 12th February 2007
It may not be long before swarms of tiny mobile robots will be giving a hand to the nurses and medical orderlies in hospitals.
Monday 12th February 2007
ARM has announced that Renesas Technology Corp. has licensed the high-performance, low-power ARM1176JZF-S processor for the development of advanced mobile/consumer electronics applications.
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Friday 9th February 2007
NXP Semiconductors announced it will acquire the Cellular Communications Business of Silicon Laboratories Inc. for US$285 million [approximately 220 million Euro equivalent] in cash.
Friday 9th February 2007
With record 2006 sales and a continuing momentum of design wins in January, Tevet Process Control Technologies has established its presence within the highly competitive semiconductor metrology market.
Thursday 8th February 2007
NTT DoCoMo, Inc., Renesas Technology Corp., Fujitsu Limited, Mitsubishi Electric Corporation, Sharp Corporation, and Sony Ericsson Mobile Communications, have announced that they plan to jointly develop a next-generation mobile phone platform1 for dual-mode handsets supporting HSDPA2/W-CDMA (3G) and GSM/GPRS/EDGE (2G). Development of the platform is targeted to complete during 2008.
Thursday 8th February 2007
Corning Incorporated announced that its board of directors has approved a capital expenditure plan of $160 million to further expand its capacity to manufacture large size glass substrates for active matrix liquid crystal displays (LCD) at its facility in Shizuoka, Japan.
Thursday 8th February 2007
Semiconductor Research Corporation (SRC has announced that Tokyo Electron Limited (TELhas joined the consortium's community of 23 companies and partners plus 100 universities worldwide.
Thursday 8th February 2007
Axcelis Technologies, Inc. has received a significant follow-on order for over 10 RadiantStrip 320 photoresist dry strip systems from a major memory device manufacturer.
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Thursday 8th February 2007
Rim Semiconductor Company has completed a representative agreement with Axellence, launching sales and marketing programs in Austria, Belgium, Germany, Greece, Italy, Netherlands, Slovenia, and Switzerland.
Thursday 8th February 2007
NEC Corporation and Ubiquisys Ltd have announced a strategic collaboration to deliver femtocell solutions worldwide.
Wednesday 7th February 2007
Asyst Technologies, Inc. has announced several organizational changes to unify the company under a single global structure.
Wednesday 7th February 2007
EV Group (EVG) announced it has formed a collaborative product development partnership with GenISys for the development and marketing of a simulation platform for advanced mask aligner lithography processes.
Wednesday 7th February 2007
Micralyne Inc has broken ground on a facility expansion that will increase its manufacturing capacity to accommodate its growing customer base.
Tuesday 6th February 2007
Front-end engineers at SEMATECH will combine planar CMOS approaches with new channel materials to develop effective transistors for the 22 nm half-pitch technology generation – but will continue to investigate FinFET devices as an alternative approach.
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Tuesday 6th February 2007
Wind River Systems, Inc. has announced a new collaboration with Texas Instruments Incorporated (TI) to enable Wind River’s Linux-based device software platform and Wind River Workbench development tools, including Wind River Workbench On-chip Debugging tools, on TI’s OMAP2430 applications processor for handsets and personal digital assistants (PDAs).
Tuesday 6th February 2007
ClearSpeed Technology has announced that the company is part of a $1.4 million contract to provide the first national supercomputer to South Africa's Centre for High Performance Computing (CHPC).
Tuesday 6th February 2007
Forza Silicon and Tower Semiconductor have announced that they are expanding their relationship to design and produce mixed signal and image sensor chips utilizing Tower's process and design technology capabilities.
Tuesday 6th February 2007
Seiko Epson Corp. ("Epson has purchased an MA200Compact Mask Aligner from SUSS MicroTec to support their Wafer Level Chip Scale Packaging (W-CSP) production.
Monday 5th February 2007
A future marred by stronger storms, rising sea levels and a dramatic increase in global temperatures unless stronger efforts are made to reduce carbon emissions is depicted in the new report by the U.N. Intergovernmental Panel on Climate Change. But with today's business models generating tremendous strain on the environment, how can free-market capitalism be reconciled with the need for more sustainable business practices?
Monday 5th February 2007
Taiwan Semiconductor Manufacturing Company, Inc. announced that it has opened an office in Bangalore, India.

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