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Monday 22nd January 2007
Hoku Materials, a division of Hoku Scientific, Inc. has announced the signing of a definitive contract with Sanyo Electric Company, Ltd., for the sale and delivery of polysilicon to SANYO over a seven-year period beginning in January 2009.
Monday 22nd January 2007
The Open NAND Flash Interface (ONFI) Working Group, an organization dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) devices, computing platforms and industrial systems, has announced the availability of the ONFI 1.0 specification. The chip-level standard interface simplifies Flash controller design, which facilitates the integration of a wide range of NAND Flash components into diverse end-use applications.
Friday 19th January 2007
SoftJin and Cswitch Corporation announced the companies are setting up of an Off-Shore Development Centre (ODC) in India to focus on developing customized EDA tools for customers and for in-house use of Cswitch.
Friday 19th January 2007
Cabot Microelectronics Corporation announced that it filed a legal action against DuPont Air Products NanoMaterials LLC (DA Nano) for DA Nano's manufacture and marketing of certain CMP slurries that infringe patents owned by Cabot Microelectronics.
Friday 19th January 2007
Praxair China and Semiconductor Manufacturing International Corp. (SMIC) have signed a contract for Praxair to supply industrial gases to SMIC's new FAB 8 facility in Shanghai, China.
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Friday 19th January 2007
Rudolph Technologies, Inc. has announced a milestone 50th installation at a large Korean memory manufacturer for its AXi 930 Advanced Macro Defect Inspection System.
Thursday 18th January 2007
According to data in IC Insights¹ 2007 edition of The McClean Report, A Complete Analysis and Forecast of the Integrated Circuit Industry, fabless IC suppliers secured 20% of worldwide IC sales in 2006, an increase from just under 10% of the total IC market in 2000.
Wednesday 17th January 2007
The SEZ Group has reported another record year of sales and order figures for the business year 2006. Order intake increased by 39.3 percent to 407.7 million Swiss Francs (CHF) and surpassed CHF 400 million for the first time.
Tuesday 16th January 2007
NXP Semiconductor, founded by Philips, and Taiwan Semiconductor Manufacturing Company Limited (TSMC) have announced they will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as manufacturing partnership.
Tuesday 16th January 2007
NXP Semiconductors has announced it shall not extend its current cooperation in the Crolles2 Alliance beyond the initial term expiring at the end of 2007.
Tuesday 16th January 2007
Renesas Technology and Powerchip Semiconductor have announced agreement to establish a joint venture that will specialize in the design of advanced memory devices.
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Tuesday 16th January 2007
HP has unveiled research that could lead to the creation of field programmable gate arrays (FPGAs) up to eight times denser – while using less energy for a given computation – than those currently produced.
Tuesday 16th January 2007
Ovonyx, Inc. and Qimonda have announced that they have entered into a long-term cross license agreement for discrete memory products using Ovonyx' and Qimonda's patents and intellectual property relating to Phase Change Random Access Memory (PCRAM) technology.
Tuesday 16th January 2007
Rite Track has announced the completion of an expansion of agreement with Tokyo Electron Limited (TEL).
Monday 15th January 2007
Frontier Silicon has announced that it has secured a GBP £16million financing round led by new investor Mitsui Private Equity.
Monday 15th January 2007
Mentor Graphics Corporation and Actel Corporation have announced the signing of a new OEM agreement between the two companies, expanding the companies' existing technology and marketing partnership.
Friday 12th January 2007
Renesas Technology Corp. has announced a reorganization of its sales and application technology support structure in China with the aim of expanding its business in that country.
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Friday 12th January 2007
Aegis Semiconductor announced that it has changed its name to Aegis Lightwave.
Friday 12th January 2007
Mentor Graphics Corporation and EVE announced that they have settled the parties' ongoing patent litigation.
Friday 12th January 2007
Tegal Corporation announced that it had received a repeat order for its Endeavor AT PVD cluster tool from a U.S.-based global, power management device manufacturer.
Friday 12th January 2007
Eyelit, Inc has announced that it has joined the Fab Owners Association (FOA).
Friday 12th January 2007
Magma Design Automation Inc. announced that the third and final patent at issue in its lawsuit with Synopsys Inc. has been accepted for re-examination after the U.S. Patent and Trademark Office (PTO) found substantial new questions of patentability as to all 54 of the patent's claims.
Friday 12th January 2007
Hoku Materials, a division of Hoku Scientific, Inc. has announced it plans to build a $220 million polysilicon production plant in Pocatello with a payroll of 200 when the plant initiates operations. The City of Pocatello has reserved 450 acres of vacant land for Hoku's facilities and future expansion.

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