Hoku Materials, a division of Hoku Scientific, Inc. has announced the signing of a definitive contract with Sanyo Electric Company, Ltd., for the sale and delivery of polysilicon to SANYO over a seven-year period beginning in January 2009.
The Open NAND Flash Interface (ONFI) Working Group, an organization dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) devices, computing platforms and industrial systems, has announced the availability of the ONFI 1.0 specification. The chip-level standard interface simplifies Flash controller design, which facilitates the integration of a wide range of NAND Flash components into diverse end-use applications.
SoftJin and Cswitch Corporation announced the companies are setting up of an Off-Shore Development Centre (ODC) in India to focus on developing customized EDA tools for customers and for in-house use of Cswitch.
Cabot Microelectronics Corporation announced that it filed a legal action against DuPont Air Products NanoMaterials LLC (DA Nano) for DA Nano's manufacture and marketing of certain CMP slurries that infringe patents owned by Cabot Microelectronics.
According to data in IC Insights¹ 2007 edition of The McClean Report, A Complete Analysis and Forecast of the Integrated Circuit Industry, fabless IC suppliers secured 20% of worldwide IC sales in 2006, an increase from just under 10% of the total IC market in 2000.
The SEZ Group has reported another record year of sales and order figures for the business year 2006. Order intake increased by 39.3 percent to 407.7 million Swiss Francs (CHF) and surpassed CHF 400 million for the first time.
NXP Semiconductor, founded by Philips, and Taiwan Semiconductor Manufacturing Company Limited (TSMC) have announced they will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as manufacturing partnership.
HP has unveiled research that could lead to the creation of field programmable gate arrays (FPGAs) up to eight times denser – while using less energy for a given computation – than those currently produced.
Ovonyx, Inc. and Qimonda have announced that they have entered into a long-term cross license agreement for discrete memory products using Ovonyx' and Qimonda's patents and intellectual property relating to Phase Change Random Access Memory (PCRAM) technology.
Magma Design Automation Inc. announced that the third and final patent at issue in its lawsuit with Synopsys Inc. has been accepted for re-examination after the U.S. Patent and Trademark Office (PTO) found substantial new questions of patentability as to all 54 of the patent's claims.
Hoku Materials, a division of Hoku Scientific, Inc. has announced it plans to build a $220 million polysilicon production plant in Pocatello with a payroll of 200 when the plant initiates operations. The City of Pocatello has reserved 450 acres of vacant land for Hoku's facilities and future expansion.