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News Article

New Technology for Thin Wafer Handling

Brewer Science, Inc., the inventor of ZoneBOND and SUSS MicroTec , are joining forces in commercializing ZoneBOND technology for thin wafer handling. 

SUSS MicroTec, specialist in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers. 

Brewer Science offers products specifically designed for the implementation of the ZoneBOND process including materials for carrier preparation, adhesives, removers, as well as small scale debonding equipment. 

ZoneBOND technology is an advanced solution for wafer handling that provides total thickness variation (TTV) control, high-temperature stability, and low-stress debonding. Customers will benefit through higher yield at debonding, higher throughput, and lower cost of ownership.


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