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Thursday 5th October 2006
SPIRIT DSP and ARM announced a strategic partnership to deliver outstanding multimedia performance to mobile digital audio and voice devices.
Thursday 5th October 2006
Silicon Integration Initiative (Si2) announced the formation of the Low-Power Coalition (LPC) which will deliver enhanced capabilities in low-power Integrated Circuit (IC) design flows relating to specifications of low-power design intent, architectural tradeoffs, logical/physical implementation, design verification and testability.
Thursday 5th October 2006
Air Products announced it will construct a nitrogen trifluoride (NF3) plant in Ulsan, Korea to support the fast growing Asian semiconductor and liquid crystal display (LCD) markets.
Thursday 5th October 2006
Jordan Valley has signed an agreement with OpenDream of Korea for sales and support of their x-ray metrology equipment to the Korean semiconductor marketplace.
Wednesday 4th October 2006
KPIT Cummins Infosystems Limited and Renesas Technology Corp. announced Renesas has established a dedicated off-shore development centre (ODC(1)) at KPIT Cummins to strengthen its development and design capabilities.
Wednesday 4th October 2006
Apache Design Solutions and NEC Electronics announced that they have collaborated to address the power integrity challenges associated with system-in-package (SiP) designs.
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Wednesday 4th October 2006
Leading suppliers of silicon wafers participated in a consensus survey, obtained from SEMI surveying the SMG members. This survey provides an outlook for the demand in silicon units for the period 2006 – 2009.
Wednesday 4th October 2006
Digi-Key Corporation and Winbond Electronics Corporation America announced the expansion of the companies' current distribution agreement to include Europe.
Wednesday 4th October 2006
Brion Technologies announced that it had received another order for Tachyon OPC+ from a major Japanese consumer electronics company.
Wednesday 4th October 2006
Nu Horizons Electronics Corp. and OSRAM Opto Semiconductors, Inc announced a partnership agreement throughout the United States, Canada and Mexico effective October 1, 2006.
Wednesday 4th October 2006
The University of Sheffield has invested £10M to create a new Nanoscience and Technology Centre which incorporates the UK's largest cleanroom laboratory for research into semiconductors, nano-magnetics and other devices.
Tuesday 3rd October 2006
Major breakthroughs in the use of micro and nano technologies (MNTs) for satellite and commercial defense avionics applications were unveiled on an international scale at the CANEUS 2006 Conference held in Toulouse, France, home of Airbus Industries in France's Aerospace Valley.
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Tuesday 3rd October 2006
UMC semiconductor foundry and Singapore's Institute of Microelectronics (IME), have sealed a partnership to jointly develop Radio Frequency (RF) modeling solutions for 90nm technologies. The cooperation will result in the development of new methodologies that are applicable for advanced technologies at 90nm and beyond.
Tuesday 3rd October 2006
CVI Technical Optics is pleased to announce the completion of the integration of Quality Laser Optics (QLO).
Monday 2nd October 2006
PMC-Sierra, Inc. announced that NEC has selected PMC-Sierra's metro transport semiconductor solutions for incorporation into its SpectralWave series.
Monday 2nd October 2006
Magma Design Automation Inc. announced that a motion by Synopsys Inc. seeking to impede a possible re-examination of two patents at issue in the companies' ongoing dispute was denied.
Monday 2nd October 2006
SRS Labs, Inc. announced it has completed restructuring its business by finalizing the sale of its semiconductor subsidiary, Valence Technology Limited ("Valence"), to Noblehigh Enterprises Inc. ("Noblehigh").
Monday 2nd October 2006
Hakuto represents NexTech’s products throughout the Asia Pacific Rim countries of Japan, Korea, Taiwan, China, Singapore and Malaysia. The NexTStar G4 NanoScan is equipped with both brightfield and darkfield illumination and is designed to inspect unpatterned glass or patterned thin films on glass substrates of dimensions 920mm X 740mm in size. The NexTStar NanoScan will provide sub-micron inspection capability for FPD/TFT panels on patterned glass for defects 300 nanometers (0.3µ) or larger in size. The NexTStar NanoScan G4 AOI system is scheduled to be delivered to Hakuto, Japan in the late 4th Qtr. of 2006. NexTech’s CEO, Mr. Tony Di Napoli, states, “We are especially excited about our product line-up in the FPD market. This is a 70+ billion dollar market that has been growing at a double-digit rate year-to-year. The technology advantage that we enjoy with our inspection products allows us to compete aggressively in this market as these tools play an integral role in increasing customer yields and overall manufacturing excellence.”
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Monday 2nd October 2006
European semiconductor sales showed a positive development in August over July. Shipments of Microprocessors, under the spotlight in the previous months, reported a good result, in Europe as well as across other Regions.
Monday 2nd October 2006
NexTech Solutions announced a Purchase Order for their newly introduced Generation Four (G4) NexTStar NanoScan AOI system.
Monday 2nd October 2006
Worldwide sales of semiconductors reached an all-time monthly record of $20.5 billion in August, an increase of 10.5 percent from the $18.6 billion reported in August 2005, the Semiconductor Industry Association (SIA) reported.
Monday 2nd October 2006
Cypress Semiconductor Corp. launched a $160,000 global design competition that enables students who design with Cypress technology to compete regionally for Cypress innovation awards of up to $20,000 in cash and ultimately win the T.J. Rodgers Trophy, named after Cypress's president and CEO.
Wednesday 27th September 2006
IMEC, Europe's leading independent nanoelectronics and nanotechnology research institute, will present together with its core partners 17 papers at the IEEE International Electron Devices Meeting this December. This is a record in number of papers at the IEDM and will, showcase the success of IMEC's global R&D efforts to create solutions for (sub-)32nm scaling.
Wednesday 27th September 2006
In a speech today at the Intel Developer Forum, Intel Senior Fellow and Chief Technology Officer Justin Rattner said that during the next decade online software services, hosted by mega data centers with more than a million servers, will allow people to access personal data, media and applications from any high-performance device to play photo-realistic games, share real-time video and do multimedia data mining. This new usage model will challenge the industry to deliver the one trillion floating-point operations-per-second (teraFLOPs) of performance and terabytes of bandwidth.

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