The SEZ Group has introduced its Esanti platform targeting front-end-of-line (FEOL) cleaning and resist-stripping processes. SEZ has become the market leader in the back-end-of-line (BEOL) single wafer wet processing by being the first in the arena and maintaining a technology lead.
The CEO Members of the EU ICT Task Force presented their final Report entitled ;"Fostering the Competitiveness of Europe's ICT Industry" to Commission Vice-President Günter Verheugen (Enterprise & Industry) and to Commissioner Viviane Reding (Information Society & Media).
Eyelit, Inc., manufacturing software provider of operations for the electronics, MEMS and semiconductor industries announced that Touchdown Technologies, developer and manufacturer of advanced MEMS probecards, has purchased Eyelit’s Enterprise Manufacturing Execution suite to manage and control its production operations.
Honeywell Specialty Materials announced that it will expand its Shanghai-based Asia Technology Centre to boost its research and development capability and meet increasing customer needs in Asian markets, particularly China.
NXP Semiconductors, formerly Philips Semiconductors, and Sony Corporation have signed a memorandum of understanding (MOU) to establish by mid-year 2007 a joint venture (JV) that will drive global adoption of contactless smart card applications in mobile phones.
A University of Utah physicist took a step toward developing a superfast computer based on quantum physics by showing it is feasible to read data stored in the form of the magnetic "spins" of phosphorus atoms.
Applied Ventures, LLC, the venture capital fund of Applied Materials, has announced that it has invested $3.0 million in Solaicx, a private manufacturer of single-crystal silicon wafers for the solar photovoltaic (PV) industry.