Synova announced it has closed financing in the amount of 10 million Swiss francs (CHF), or USD 8.1 million. Synova will use the new funds, put up largely by Swiss banks, for the development of micromachining centres (MMCs) located in key high-tech regions around the world, providing local access to customer support and application labs offering on-site product demonstrations.
Alliance Semiconductor Corporation received a Nasdaq additional Staff determination letter indicating that the Nasdaq Staff believes the Company is no longer engaged in active business operations and is therefore a "public shell."
Seeking to promote and drive continuous improvement of supplier diversity in the semiconductor industry, a SEMATECH-led industry group working with a consultant has published an industry study that outlines the business outlook and strategies for supplier diversity in one of the world's most volatile markets.
Freescale Semiconductor, Inc. has announced that they have signed an agreement for Freescale's use of Synopsys electronic design automation software for the functional verification of complex semiconductor designs.
Braggone announced that it has raised a new financing round to support ramp-up of its production. The new funding of approximately $1.5 million was provided by existing backers of the company and will be used to further facilitate its production site in Finland.
Air Products announced leadership and organization changes effective October 1, 2006 to reflect the company's strategy and focus on growth. John E.
McGlade, currently group vice president, Chemicals, has been named president and chief operating officer by the Board of Directors.
Toshiba Corporation (Minato-ku, Tokyo, Japan) and SanDisk Corporation announced that, further to definitive agreements that the companies entered into in July 2006, construction has started of Fab 4, a 300-millimeter (mm) wafer fab, in Yokkaichi, in Mie Prefecture, Japan.
Avnet Electronics Marketing, Americas, announced it has signed a distribution agreement with Tundra Semiconductor Corp. to promote, supply and support Tundra System Interconnect products throughout North America.
Dongbu Electronics announced that it has collaborated with Cadence Design Systems, Inc. to develop a high-voltage BCDMOS (Bipolar, CMOS, DMOS) Process Design Kit (PDK) to facilitate the processing of 60V chip designs at the 0.35-micron node.
JMAR Technologies, Inc. has received a $3.1 million award by Naval Air Systems Command (NAVAIR). This is the latest increment to be added to JMAR's current contract, valued at $17.5 million, to continue development of sub-100nm feature x-ray masks and next generation nanolithography.