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Tuesday 25th July 2006
The Silicon Integration Initiative (Si2) and The SPIRIT Consortium announced a strategic partnership and cross-membership agreement to facilitate tighter collaboration designed to improve the productivity of the total system-on-chip (SoC) design flow. The two organizations will work together to coordinate technical roadmaps, targeting consistency of data shared among OpenAccess and Open Modeling efforts provided by Si2 and IP-XACT specifications provided by The SPIRIT Consortium. The organizations will also coordinate an integrated architecture that takes advantage of the highly complementary technology offerings. Technical details will be coordinated through the many common members of both organizations.
Tuesday 25th July 2006
SRI International announced it is collaborating with United States-Mexico Foundation for Science to develop a strategy for capturing the opportunities offered by the growing micro-electromechanical systems (MEMS) market and the MEMS R&D capabilities in the state of Puebla, Mexico.
Tuesday 25th July 2006
Cadence Design Systems, Magma Design Automation Inc. and Extreme DA, with support from ARM, Virage Logic Corporation, and Altos Design Automation, announced their collaboration to accelerate the creation of a standard statistical analysis library format under the Open Modeling Coalition of Si2. This open statistical library format will be based on current source models. In addition to enabling interoperability between design tools and methodologies for 65-nanometer (nm) design and below, the intent is to create a comprehensive solution that will eliminate the need for designers to support multiple library formats -- a time-consuming and costly undertaking that introduces errors into the design process and delays the delivery of complex integrated circuits (ICs).
Tuesday 25th July 2006
;Teradyne, Inc. announced Vimicro International Corporation of Beijing, China has selected the J750 as its major device test platform and purchased multiple systems for engineering and production test of multi-media processors.
Tuesday 25th July 2006
The NFC Forum, a non-profit industry association advancing the use of Near Field Communication (NFC) technology, announced its latest Sponsor Member: HP. The Forum also added three Associate Members in July, bringing total membership to 85 organizations. The Forum recently unveiled its technology architecture, which will serve as the foundation for interoperable NFC products and services.
Tuesday 25th July 2006
Sierra Design Automation, Inc announced that Fujitsu Limited is deploying Sierra Pinnacle for its 90nm and 65nm designs. Sierra Pinnacle is now a part of Fujitsu's design methodology and addresses the requirements of high end designs, including high capacity, high performance and multiple design modes/multiple process corners.
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Tuesday 25th July 2006
Applied Wave Research, Inc. (AWR(R)), and Pulsic Ltd., Bristol, England, announced that Pulsic's Lyric Automatic Routing system is now integrated into AWR's Analog Office 2006 design suite for analogue and radio-frequency integrated circuit (RFIC) design. Through the Analogue Office OpenAccess open standard data access interface (API), interconnects represented by the unique Analog Office Intelligent Net(TM)2 (iNet2) technology can now be automatically routed in Pulsic's full-featured, automatic, constraint-driven, shaped-based Lyric Automatic Routing system. The new solution enables high-frequency analogue, RF, and mixed-signal designers to access the Pulsic routing system without leaving the Analog Office design environment, saving design time, increasing accuracy, and speeding designs to final tape-out.
Monday 24th July 2006
Nanometrics Incorporated has completed its acquisition of Accent Optical Technologies, Inc. Accent Optical is a supplier of overlay and thin film metrology and process control systems to the global semiconductor manufacturing industry. The transaction was approved both by Accent Optical's and by Nanometrics' shareholders at their respective special meetings.
Monday 24th July 2006
Blaze DFM, Inc. announced that it has strengthened its relationship with Taiwan Semiconductor Manufacturing Company (TSMC) to include TSMC support for Blaze MO optimization software. The two companies have developed Blaze MO design kits and are working together to make this technology available for evaluation.
Monday 24th July 2006
Nanometrics Incorporated has completed its acquisition of Accent Optical Technologies, Inc.
Monday 24th July 2006
PDF Solutions, Inc. recently marked its most recent geographic expansion with the grand opening of its office in Shanghai, China.
Monday 24th July 2006
SEQUANS Communications has raised US $24 million in a new round of equity financing. The round was led by Kennet Venture Partners, a private equity firm that provides growth equity to technology businesses in Europe and the US. SEQUANS' existing investors, Add Partners, Cap Decisif, T-Source, SG Asset Management and Vision Capital, also participated in the round.
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Monday 24th July 2006
Tessera Technologies, Inc. announced a definitive agreement with Micron Technology, Inc. entering into a technology license agreement.
Monday 24th July 2006
SiTime Corporation, and Jazz Semiconductor announced a partnership to bring SiTime's MEMS First silicon mechanical oscillator products to market at Jazz Semiconductor's 200mm wafer foundry.
Friday 21st July 2006
EV Group (EVG) and Brewer Science have announced that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system. ;
Friday 21st July 2006
India Semiconductor Association (ISA), the national body for the Indian semiconductor industry released its first Member Directory at their Annual Dinner celebrations on July 18, 2006.
Thursday 20th July 2006
Applied Materials, Inc. and Dainippon Screen Mfg. Co., Ltd. (Screen) have announced that they have completed the formation of Sokudo Co., Ltd., a joint venture company.
Wednesday 19th July 2006
e2v technologies plc ("e2v", the "Company" or the "Group"), announced that its subsidiary, e2v technologies S.A.S., has conditionally agreed to acquire Atmel Grenoble S.A.S. ("Atmel Grenoble") for a total consideration of US$140 million (approximately £76 million) in cash subject to a post-completion adjustment based upon the level of net working capital in Atmel Grenoble at completion (the "Acquisition").
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Wednesday 19th July 2006
Samsung Electronics Co., Ltd. announced that it has begun mass producing an 8-Gigabit (Gb) NAND flash memory device, providing a much larger and more affordable storage density for consumer and mobile applications such as mobile phones, MP3 players and gaming consoles.;The high-density MLC (multi-level-cell) memory is being produced with 60-nanometer (nm) process technology - the smallest used today. ;
Wednesday 19th July 2006
e2v technologies plc (“e2v”, the “Company” or the “Group”), announced that its subsidiary, e2v technologies S.A.S., has conditionally agreed to acquire Atmel Grenoble S.A.S. (“Atmel Grenoble”) for a total consideration of US$140 million (approximately £76 million) in cash subject to a post-completion adjustment based upon the level of net working capital in Atmel Grenoble at completion (the “Acquisition”).
Wednesday 19th July 2006
Carl Zeiss SMT has acquired 100% of the shares of ALIS Corporation, Peabody, USA for its Nano Technology Systems Division (NTS). ALIS´ newly developed helium ion microscopy technology will add an important building block to Carl Zeiss SMT´s existing portfolio of charged-particle technologies aimed at nano-scale imaging, structuring and analysis applications. ;;
Tuesday 18th July 2006
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