The US-Taiwan Business Council welcomes the comments by the Investment Commission of the Ministry of Economic Affairs (MOEA), indicating that Taiwan will finalize a plan by the end of 2006 that would allow its chipmakers to use 0.18-micron manufacturing technology in China.
HCL Technologies Ltd an R&D, IT services, and business process outsourcing firm, and Celestica Inc., an electronics manufacturing service announced that the two companies have entered into an agreement to form a joint venture to provide complete concept-to-manufacturing (C2M) solutions for original equipment manufacturers (OEMs).
ATDF is expanding availability of its 454AZ CoMPetitor test mask after a key supplier reported using it to develop a breakthrough process for low-impact chemical-mechanical planarization (CMP) of semiconductor wafers.
Tegal Corporation announced that its wholly-owned subsidiary, Sputtered Films Inc. (SFI) agreed to terms settling its trade secrets case against Sergey Mishin, Advanced Modular Sputtering (AMS), Agilent Technologies, Inc., Avago Technologies U.S., Inc., Avago Technologies Wireless (U.S.A) Manufacturing, Inc. and other defendants.
In response to a Request For Technology (RFT) issued earlier this year, a statistical library format has been contributed to the Open Modeling Coalition (OMC) of the Silicon Integration Initiative (Si2)
Worldwide silicon wafer area shipments increased over 5 percent during the third quarter 2006 when compared to the second quarter 2006 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
Stockholders of Freescale Semiconductor, Inc. have approved the previously announced acquisition of Freescale by a consortium of private equity firms led by The Blackstone Group and including The Carlyle Group, Permira Funds and Texas Pacific Group.
Worldwide market revenue for NAND-type flash memory in the third quarter slightly exceeded iSuppli Corp.'s forecast— but disappointing sales of MP3 players has prompted a downgrade of our outlook for fourth-quarter sales.
Intel Corporation announced that it will increase the size of the assembly and test facility it is building in Vietnam from 150,000 square feet to 500,000 square feet and raise its investment from the USD$300 million announced in February to USD$1 billion.
The NSF Centre for High-rate Nanomanufacturing is pleased to announce the Roger H. Grace Fellowship in Nanomanufacturing. Applications are now being accepted for the Spring 2007 semester, and the 2007 – 2008 academic year.